# US 7,609,378 B2 · Structure for supporting sample to be subjected to surface enhanced vibrational spectroscopic analysis and method of manufacturing the same

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- Number: US 7,609,378 B2
- Document ID: US7609378B2
- Status: Granted
- Kind: B2
- Application number: 12/110,779
- Filed: 2008-04-28
- Published: 2008-11-20
- Granted: 2009-10-27
- Earliest claimed: 2007-05-14
- Assignees: Canon Kabushiki Kaisha
- Inventors: Kaoru Konakahara
- Web page: https://patentgrep.com/patent/US7609378B2

## CPC

- G01N 21/658: {enhancement Raman, e.g. surface plasmons}
- G01N 21/03: Cuvette constructions
- G01N 21/3563: for analysing solids; Preparation of samples therefor
- Y10T 428/24322: Composite web or sheet
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A structure for supporting a sample to be subjected to a surface enhanced vibrational spectroscopic analysis includes a substrate, a ground film formed on the substrate, and a base formed on the ground film. The base includes a plurality of holes formed in a direction perpendicular to the substrate. Metal fine particles are exposed on inner surfaces of the holes formed in the base and on a surface of the base.

## Claims

### Claim 1

A structure for supporting a sample to be subjected to surface enhanced vibrational spectroscopic analysis, comprising:
a substrate;
a ground film formed on the substrate; and
a base formed on the ground film,
wherein the base includes a plurality of holes formed in a direction perpendicular to the substrate and metal fine particles are exposed on inner surfaces of the holes formed in the base and on a surface of the base,
wherein the base is one of:
a film in which a layer including metal fine particles and an Al layer are alternately layered;
a film in which a layer including metal fine particles and an Si layer are alternately layered;
an Si layer in which metal fine particles are dispersed; and
a film in which a mixed layer including Al and at least one of Si and Ge and a layer including metal fine particles are alternately layered.

### Claim 2 (depends on 1)

A structure according to claim 1, wherein the metal fine particles have an exposed portion covered with a metal film.

### Claim 3 (depends on 1)

A structure according to claim 1, wherein the holes have a diameter of 1 nm to 1 μm, a center-to-center distance of 3 nm to 1.5 μm, and an aspect ratio equal to or larger than 2.

### Claim 4 (depends on 1)

A structure according to claim 1, wherein the layer including the metal fine particles, the Al layer and the Si layer have a film thickness of 1 nm to 100 nm.

### Claim 5 (depends on 1)

A structure according to claim 1, wherein the metal fine particles comprise a material selected from the group consisting of Au, Ag, Pd, Pt, and MxSi1-x, with 0≦X≦1, M is one of Au, Ag, Pd, and Pt.

### Claim 6 (depends on 1)

A structure according to claim 1, wherein the metal fine particles have a particle size of 1 nm to 30 nm, and an interspace distance of 0 nm to 100 nm.

### Claim 7 (depends on 2)

A structure according to claim 2, wherein the metal film is comprised of either one of Au and Pt.

### Claim 8 (depends on 2)

A structure according to claim 2, wherein the metal film has a film thickness of 1 nm to 30 nm.

### Claim 9 (depends on 1)

A structure according to claim 1, wherein the ground film comprises a material selected from the group consisting of Au, Pd, and Pt.

### Claim 10

A method of manufacturing a structure for supporting a sample to be subjected to surface enhanced vibrational spectroscopic analysis, at least comprising the steps of:
forming a ground film on a substrate;
forming, as a base, a film including metal fine particles on the ground film; and
forming a plurality of holes in the base in a direction perpendicular to the substrate;
wherein the metal fine particles are exposed on inner surfaces of the holes formed in the base and on a surface of the base by the step of forming the film and the step of forming the holes,
wherein the base is one of:
a film in which a layer including metal fine particles and an Al layer are alternately layered;
a film in which a layer including metal fine particles and an Si layer are alternately layered;
an Si layer in which metal fine particles are dispersed; and
a film in which a mixed layer including Al and at least one of Si and Ge and a layer including metal fine particles are alternately layered.

### Claim 11 (depends on 10)

A method according to claim 10, further comprising the step of dispersing the metal fine particles by heat treatment after the step of forming the film including the metal fine particles.

### Claim 12 (depends on 10)

A method according to claim 10, wherein the step of forming the holes in the base is performed using one of anodic oxidation and etching.

### Claim 13 (depends on 10)

A method according to claim 10, further comprising the step of forming a metal film to cover the metal fine particles after the step of forming the holes.

### Claim 14 (depends on 13)

A method according to claim 13, wherein the step of forming the metal film is performed using plating.