# US 7,609,211 B2 · High-directivity microstrip antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,609,211 B2 - Document ID: US7609211B2 - Status: Granted - Kind: B2 - Application number: 11/812,973 - Filed: 2007-06-22 - Published: 2008-10-02 - Granted: 2009-10-27 - Earliest claimed: 2007-04-02 - Assignees: Wistron Corporation - Inventors: Chieh-Sheng Hsu; Chang-Hsiu Huang - Web page: https://patentgrep.com/patent/US7609211B2 ## CPC - H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A high-directivity microstrip antenna comprising a dielectric layer with a first surface and a second surface that respectively connects to a metal patch and a ground metal layer, wherein the dielectric layer has a through-hole with a metal element connecting to the first surface and the second surface, and the metal element is positioned at the interior of the through-hole, wherein the two ends of the metal element respectively electrically connects to the metal patch and the ground metal layer for having higher directivity when the antenna is designed in a fixed dimension; also, for saving cost by selecting a dielectric layer with various coefficients. ## Claims ### Claim 1 A high-directivity microstrip antenna for having higher directivity and with lower cost, comprising: a dielectric layer having the opposite first and second surfaces; a metal patch connecting to the first surface for receiving radiate electromagnetic waves; a ground metal layer connecting to the second surface for grounding; wherein the dielectric layer has a plurality of through-holes arrayed in a circle, each through-hole having a metal element connecting to the first surface and the second surface, and said metal element positioned into the interior of each of the through-holes has two ends that respectively electrically connects to the metal patch and the ground metal layer, wherein the dielectric layer and the metal patch are both formed to be circular. ### Claim 2 (depends on 1) The high-directivity microstrip antenna of claim 1, wherein the metal element is a hollow ring, a solid pillar or a metal foil connecting to the interior wall of the through-hole. ### Claim 3 (depends on 2) The high-directivity microstrip antenna of claim 2, wherein the metal patch has an aperture connecting to the through-hole. ### Claim 4 (depends on 3) The high-directivity microstrip antenna of claim 3, wherein the through-hole of the dielectric layer has an electronic element. ### Claim 5 (depends on 4) The high-directivity microstrip antenna of claim 4, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 6 (depends on 3) The high-directivity microstrip antenna of claim 3, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 7 (depends on 2) The high-directivity microstrip antenna of claim 2, wherein the ground metal layer has a third through-hole opposite to the through-hole. ### Claim 8 (depends on 7) The high-directivity microstrip antenna of claim 7, wherein the through-hole of dielectric layer has an electronic element. ### Claim 9 (depends on 8) The high-directivity microstrip antenna of claim 8, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 10 (depends on 7) The high-directivity microstrip antenna of claim 7 wherein the metal patch has an aperture connecting to the through-hole. ### Claim 11 (depends on 10) The high-directivity microstrip antenna of claim 10, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 12 (depends on 7) The high-directivity microstrip antenna of claim 7, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 13 (depends on 2) The high-directivity microstrip antenna of claim 2 wherein the metal patch and the ground metal layer respectively seals the two ends of the through-hole. ### Claim 14 (depends on 13) The high-directivity microstrip antenna of claim 13, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 15 (depends on 2) The high-directivity microstrip antenna of claim 2, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 16 (depends on 1) The high-directivity microstrip antenna of claim 1, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer. ### Claim 17 (depends on 1) The high-directivity microstrip antenna of claim 1, wherein the metal patch includes a feeding point electrically connecting to a conductive line, and wherein the dielectric layer and the ground metal layer respectively has a first through-hole and a second through-hole for disposing the conductive line extending to the exterior of the ground metal layer.