# US 7,609,130 B2 · High-frequency module including connection terminals arranged at a small pitch

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- Number: US 7,609,130 B2
- Document ID: US7609130B2
- Status: Granted
- Kind: B2
- Application number: 12/133,436
- Filed: 2008-06-05
- Published: 2008-09-25
- Granted: 2009-10-27
- Earliest claimed: 2006-08-21
- Assignees: Murata Manufacturing Co., Ltd.
- Inventors: Taturo Nagai
- Web page: https://patentgrep.com/patent/US7609130B2

## CPC

- H03H 9/725: {Duplexers}
- H01P 1/047: {Strip line joints}
- H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)}
- H03H 9/0576: {including surface acoustic wave [SAW] devices}
- H03H 9/72: Networks using surface acoustic waves
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/114: {Pad being close to via, but not surrounding the via}
- H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors}
- H05K 1/181: associated with surface mounted components
- H05K 2201/1006: Non-printed filter
- H05K 2201/10522: Adjacent components
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- H10W 70/63: Vias, e.g. via plugs
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors.

## Claims

### Claim 1

A high-frequency module comprising:
a substrate having a first main surface and a second main surface, and including a plurality of connection terminals arranged to be connected to another circuit and provided on the first main surface of the substrate;
at least one filter device mounted at a first side of the second main surface of the substrate, the at least one filter device including at least one set of an unbalanced terminal and two balanced terminals; and
at least one element mounted at a second side opposite to the first side of the second main surface of the substrate, the element being electrically connected to the at least one filter device; wherein
at least two of the plurality of connection terminals define specific connection terminals and are arranged on the first main surface of the substrate at the second side, so as to be spaced from via-hole conductors penetrating the substrate from inside a mounting area for mounting the at least one filter device on the second main surface of the substrate to the first main surface of the substrate;
at least two connection lines respectively electrically connecting the specific connection terminals and the via-hole conductors are provided on the first main surface of the substrate; and
a pitch of the specific connection terminals is less than a pitch of the via-hole conductors respectively electrically connected to the specific connection terminals via the connection lines.

### Claim 2 (depends on 1)

The high-frequency module according to claim 1, wherein the at least one filter device includes at least two sets of the unbalanced terminal and the two balanced terminals and at least two sets of filters corresponding to at least two bands, and the balanced terminals are arranged on the second main surface of the substrate, so as to be adjacent to the at least one element.

### Claim 3 (depends on 1)

The high-frequency module according to claim 1, wherein the at least one element is an inductor connected in parallel across at least one set of the two balanced terminals of the filter device.