# US 7,608,925 B2 · Relay board with bonding pads connected by wirings

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- Number: US 7,608,925 B2
- Document ID: US7608925B2
- Status: Granted
- Kind: B2
- Application number: 11/234,388
- Filed: 2005-09-26
- Published: 2007-01-25
- Granted: 2009-10-27
- Earliest claimed: 2005-07-20
- Assignees: Fujitsu Microelectronics Limited
- Inventors: Yutaka Takinomi
- Web page: https://patentgrep.com/patent/US7608925B2

## CPC

- H10W 90/00: Package configurations
- H10W 72/90: Bond pads, in general
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/01: {Manufacture or treatment}
- H10W 72/075: {of bond wires}
- H10W 72/07554: {changes in dispositions}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/5473: {multiple bond wires connected to a common bond pad}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/951: {Materials of bond pads}
- H10W 90/231: {the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure}
- H10W 90/732: {between stacked chips}
- H10W 90/752: {between stacked chips}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a lead frame of the semiconductor package and the semiconductor chip, the relay board includes a plurality of wirings each of the wirings connecting at least three bonding pads.

## Claims

### Claim 1

A semiconductor device having a structure wherein a relay board is provided on a first semiconductor chip, a second semiconductor chip is provided on the relay board, and the first semiconductor chip, the second semiconductor chip, and the relay board are packaged,
the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a lead frame of the semiconductor device and the semiconductor chip, comprising:
a plurality of wirings each of the wirings connecting at least three bonding pads on the relay board, and each of the wiring provided in one of plurality of separated layers of the relay board,
wherein the first semiconductor chip has an area larger than the relay board, and
the second semiconductor chip has an area smaller than the relay board.

### Claim 2 (depends on 1)

The relay board as claimed in claim 1, wherein the wirings are provided in a single layer of the plurality of separated layers.

### Claim 3 (depends on 1)

The relay board as claimed in claim 1, wherein a material of the relay board is selected from a group consisting of silicon, ceramic, phenol resin, glass epoxy, a polyimide film, and a polyethylene terephthalate film.

### Claim 4

A semiconductor device, comprising:
a lead frame;
a first semiconductor chip provided on the lead frame, the first semiconductor chip having a surface where a plurality of first pads are formed;
a relay board having an area smaller than an area of the first semiconductor chip, the relay board provided on the first semiconductor chip, the relay board having a surface where a plurality of second pads are formed; and
a second semiconductor chip having an area smaller than an area of the relay board, the second semiconductor chip provided on the relay board, the second semiconductor chip having a surface where a plurality of third pads are formed,
wherein a wiring connecting at least three of the second pads is formed in the relay board.

### Claim 5 (depends on 4)

The semiconductor device as claimed in claim 4, further comprising:
a first bonding wire connecting one of the plurality of first pads and one of the at least three second pads to each other; and
a second bonding wire connecting another one of the at least three second pads and one of the plurality of third pads to each other.