# US 7,608,923 B2 · Electronic device with flexible heat spreader > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,923 B2 - Document ID: US7608923B2 - Status: Granted - Kind: B2 - Application number: 11/871,207 - Filed: 2007-10-12 - Published: 2009-02-19 - Granted: 2009-10-27 - Earliest claimed: 2007-08-15 - Assignees: VIA Technologies, Inc. - Inventors: Chi-Hsing Hsu - Web page: https://patentgrep.com/patent/US7608923B2 ## CPC - H10W 40/25: characterised by their materials - H10W 40/10: Arrangements for heating - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 74/147: {the encapsulations being multilayered} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic device with the package module. ## Claims ### Claim 1 A package module, comprising: a substrate having a first surface comprising a first die region; a first die disposed in the first die region of the first surface on the substrate; and a first flexible heat spreader conformally covering and directly contacting with the first surface of the substrate and the first die, one end of the first flexible heat spreader is bonded to a circuit board. ### Claim 2 (depends on 1) The package module as claimed in claim 1, wherein the substrate further comprises a second surface opposite to the first surface, wherein the second surface comprises a second die region and at least one thermal channel region outwardly extending to an edge or corner of the substrate from an edge or corner of the second die region. ### Claim 3 (depends on 2) The package module as claimed in claim 2, further comprising: a second die disposed in the second region of the second surface on the substrate; and a second flexible heat spreader conformally covering the thermal channel region and the second die; wherein the first and second flexible heat spreaders outwardly extend from at least one edge of the substrate and bond together. ### Claim 4 (depends on 3) The package module as claimed in claim 3, wherein each of the first and second flexible heat spreaders comprises: a flexible thermally conductive layer; and an adhesion layer interposed between the substrate and the flexible thermally conductive layer. ### Claim 5 (depends on 4) The package module as claimed in claim 4, wherein the flexible thermally conductive layer comprises a metal with a thickness less than 30 μm or a carbon tube prepreg material e. ### Claim 6 (depends on 4) The package module as claimed in claim 4, wherein each of the first and second flexible heat spreaders comprises a nickel or anode oxide layer on the flexible thermally conductive layer and separated from the adhesion layer by the flexible thermally conductive layer. ### Claim 7 (depends on 4) The package module as claimed in claim 4, wherein the surface of the flexible thermally conductive layer comprises a plurality of convex patterns, such that the plurality of convex patterns passes through the adhesion layers and directly contacts the first and second dice when the first and second flexible heat spreaders are bonded to the substrate by pressure. ### Claim 8 (depends on 4) The package module as claimed in claim 4, wherein the adhesion layer comprises B-stage resin or polyimide. ### Claim 9 (depends on 1) The package module as claimed in claim 1, further comprising a package device disposed between the substrate and the first flexible heat spreader. ### Claim 10 An electronic device, comprising: a package module, comprising: a substrate having a first surface and an opposing second surface, wherein the first surface comprises a first die region; a plurality of solder balls on the second surface of the substrate arranged in an array; a first die disposed in the first die region of the first surface on the substrate; a first flexible heat spreader conformally covering and directly contacting with the first surface of the substrate and the first die; and a circuit board having a plurality of bonding pads correspondingly bonded to the plurality of solder balls. ### Claim 11 (depends on 10) The electronic device as claimed in claim 10, wherein the second surface comprises a second die region and at least one thermal channel region outwardly extending to an edge or corner of the substrate from an edge or corner of the second die region, and the plurality of solder balls are arranged on the second surface of the substrate except in the second die region and the thermal channel region. ### Claim 12 (depends on 11) The electronic device as claimed in claim 11, wherein the package module further comprises: a second die disposed in the second region of the second surface on the substrate; and a second flexible heat spreader conformally covering the thermal channel region and the second die; wherein the first and second flexible heat spreaders outwardly extend from at least one edge of the substrate and bond together. ### Claim 13 (depends on 12) The electronic device as claimed in claim 12, wherein an interval between the solder balls is narrower than a width of the thermal channel region. ### Claim 14 (depends on 11) The electronic device as claimed in claim 11, wherein the package module further comprises: a flexible thermally conductive layer; and an adhesion layer interposed between the flexible thermally conductive layer and the substrate. ### Claim 15 (depends on 14) The electronic device as claimed in claim 14, wherein the flexible thermally conductive layer comprises a metal with a thickness less than 30 μm or a carbon tube prepreg material. ### Claim 16 (depends on 14) The electronic device as claimed in claim 14, wherein each of the first and second flexible heat spreaders comprises a nickel or anode oxide layer on the flexible thermally conductive layer and separated from the adhesion layer by the flexible thermally conductive layer. ### Claim 17 (depends on 14) The electronic device as claimed in claim 14, wherein the surface of the flexible thermally conductive layer comprises a plurality of convex patterns, such that the plurality of convex patterns passes through the adhesion layers and directly contacts the first and second dice when the first and second flexible heat spreaders are bonded to the substrate by pressure. ### Claim 18 (depends on 14) The electronic device as claimed in claim 14, wherein the adhesion layer comprises B-stage resin or polyimide. ### Claim 19 (depends on 12) The electronic device as claimed in claim 12, wherein the first or second flexible heat spreader has an end bonding to the circuit board. ### Claim 20 (depends on 10) The electronic device as claimed in claim 10, wherein the package module further comprises a package device disposed between the first flexible heat spreader and the substrate.