# US 7,608,921 B2 · Multi-layer semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,921 B2 - Document ID: US7608921B2 - Status: Granted - Kind: B2 - Application number: 11/608,164 - Filed: 2006-12-07 - Published: 2008-06-12 - Granted: 2009-10-27 - Earliest claimed: 2006-12-07 - Assignees: STATS ChipPAC, Ltd. - Inventors: Rajendra D. Pendse - Web page: https://patentgrep.com/patent/US7608921B2 ## CPC - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/00: Package configurations - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the interposer substrate can be electrically coupled to the top side of the base substrate through vertical connectors. The top side of the interposer substrate is substantially exposed and comprises input/output (I/O) terminals for the mounting of additional electronic components. The base and interposer substrates can be configured with I/O terminals such that components mounted on the substrates can be electrically coupled through the vertical connectors. The base substrate also can be electrically coupled to an additional electronic component, such as a printed circuit board. Electrical connections can be “wrapped around” from the base substrate to the top of the interposer substrate. The vertical connectors can be positioned along multiple sides of the package, which can increase routing space between the substrates. ## Claims ### Claim 1 A semiconductor package comprising: a first substrate having first and second major planar surfaces defined by a first perimeter; a first semiconductor die electrically coupled to the second major planar surface of the first substrate; a second substrate having first and second major planar surfaces defined by a second perimeter; a first plurality of vertical connectors, the connectors being configured to electrically couple the first major planar surface of the second substrate to the second major planar surface of the first substrate; and a first encapsulating resin situated between the semiconductor die and the second major planar surface of the first substrate, the first encapsulating resin also encompassing at least a portion of at least some of the vertical connectors, wherein the vertical connectors are positioned substantially within the first perimeter and the second perimeter, and wherein the second major planar surface of the second substrate is substantially available for receiving one or more electronic components. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the first semiconductor die is electrically coupled to the second major planar surface of the first substrate in a flip chip configuration. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the first semiconductor die is electrically coupled to the second major planar surface of the first substrate with at least one bond wire. ### Claim 4 (depends on 1) The semiconductor package of claim 1, further comprising a second encapsulating resin situated between the second major planar surface of the first substrate and the first surface of the second substrate. ### Claim 5 (depends on 4) The semiconductor package of claim 4, wherein the first encapsulating resin and the second encapsulating resin comprise a continuous resin material. ### Claim 6 (depends on 1) The semiconductor package of claim 1, wherein at least one of the first plurality of vertical connectors comprises a bond-on-lead (BOL) connection. ### Claim 7 (depends on 1) The semiconductor package of claim 1, wherein at least a portion of one of the first plurality of vertical connectors comprises a stud bump. ### Claim 8 (depends on 1) The semiconductor package of claim 1, wherein the second major planar surface of the second substrate is configured to receive an electronic component. ### Claim 9 (depends on 8) The semiconductor package of claim 8, wherein the second major planar surface of the second substrate is further configured to receive a ball grid array, wherein at least a portion of the ball grid array has a ball pitch between about 0.25 mm and about 1.0 mm. ### Claim 10 (depends on 8) The semiconductor package of claim 8, wherein the second major planar surface of the second substrate is configured to receive at least one of the following: a flip chip component, a quad flat package, a quad flat package no leads, a molded package, or a passive component. ### Claim 11 (depends on 1) The semiconductor package of claim 1, wherein the first perimeter comprises a plurality of perimeter sides, and wherein at least some of the first plurality of vertical connectors are situated at two or more of the perimeter sides. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein at least some of the first plurality of vertical connectors are situated at three or more perimeter sides. ### Claim 13 (depends on 12) The semiconductor package of claim 12, wherein at least some of the first plurality of vertical connectors are situated at four or more perimeter sides. ### Claim 14 (depends on 1) The semiconductor package of claim 1, wherein at least some of the first plurality of vertical connectors are generally diametrically opposed along at least one of the first and second perimeter. ### Claim 15 (depends on 1) The semiconductor package of claim 1, wherein the first substrate has a substrate edge and the first semiconductor die has a die edge, and wherein the horizontal distance between the die edge and the substrate edge is between about 0.25 mm and about 1.5 mm. ### Claim 16 (depends on 15) The semiconductor package of claim 15, wherein the horizontal distance between the die edge and the substrate edge is between about 0.25 mm and about 1.0 mm. ### Claim 17 (depends on 1) The semiconductor package of claim 1, wherein the first substrate has a substrate edge and the first semiconductor die has a die edge, and wherein the horizontal distance between the die edge and the substrate edge is approximately equal to a vertical connector width. ### Claim 18 (depends on 1) The semiconductor package of claim 1, wherein the vertical distance between a surface of the first semiconductor die facing the first substrate and the first major planar surface of the second substrate is less than about 0.2 mm. ### Claim 19 (depends on 1) The semiconductor package of claim 1, wherein the first encapsulating resin comprises at least one of an epoxy material, a thermosetting material, and a thermoplastic material. ### Claim 20 (depends on 1) The semiconductor package of claim 1, further comprising: a third substrate having first and second major planar surfaces defined by a third perimeter; a second semiconductor die electrically coupled to the second major planar surface of the third substrate; and a second plurality of vertical connectors, the connectors being configured to electrically couple the first major planar surface of the first substrate to the second major planar surface of the third substrate. ### Claim 21 A semiconductor package for a semiconductor die having a horizontal size, the semiconductor package having a horizontal size approximately the same as the horizontal size of the semiconductor die, the package comprising: a first substrate having first and second major planar surfaces defined by a first perimeter, the second major planar surface having a semiconductor die coupled thereto; and a second substrate consisting of first and second major planar surfaces defined by a second perimeter, the first major planar surface of the second substrate being effectively coupled to the second major planar surface of the first substrate by one or more vertical connectors, wherein the vertical connectors are positioned substantially within the first perimeter and the second perimeter, wherein the first substrate has a substrate edge and the die has a die edge, and wherein the horizontal distance between the die edge and the substrate edge is between 0.25 mm and 1.5 mm. ### Claim 22 A semiconductor package comprising: a first substrate having first and second major planar surfaces defined by a first perimeter; a semiconductor die electrically coupled to the second major planar surface of the first substrate; a second substrate having first and second major planar surfaces defined by a second perimeter, the second major planar surface of the second substrate comprising terminals electrically coupled to terminals on the first major planar surface of the second substrate; a plurality of vertical connectors, the connectors being configured to electrically couple the first major planar surface of the second substrate to the second major planar surface of the first substrate; and an encapsulating resin situated between the semiconductor die and the second surface of the first substrate, the encapsulating resin also encompassing at least a portion of at least some of the vertical connectors, wherein the vertical connectors are positioned substantially within the first perimeter and the second perimeter, and wherein the second major planar surface of the second substrate is substantially available for receiving one or more electronic components. ### Claim 23 (depends on 22) The semiconductor package of claim 22, wherein the terminals of the second major planar surface of the second substrate are configured to receive a discrete component. ### Claim 24 (depends on 22) The semiconductor package of claim 22, wherein the first substrate has a substrate edge and the semiconductor die has a die edge, and wherein the horizontal distance between the die edge and the substrate edge is between 0.25 mm and 1.5 mm.