# US 7,608,915 B2 · Heat dissipation semiconductor package

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- Number: US 7,608,915 B2
- Document ID: US7608915B2
- Status: Granted
- Kind: B2
- Application number: 12/151,902
- Filed: 2008-05-08
- Published: 2008-11-13
- Granted: 2009-10-27
- Earliest claimed: 2007-05-11
- Assignees: Siliconware Precision Industries Co., Ltd.
- Inventors: Chun-Ming Liao; Chien-Ping Huang; Ho-Yi Tsai; Cheng-Hsu Hsiao
- Web page: https://patentgrep.com/patent/US7608915B2

## CPC

- H10W 40/778: {in encapsulations}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.

## Claims

### Claim 1

A heat dissipation semiconductor package, comprising:
a chip carrier;
a semiconductor chip mounted on and electrically connected to the chip carrier, with a surface of the semiconductor chip being defined with a heat conductive adhesive mounting area, wherein a periphery of the heat conductive adhesive mounting area is spaced apart from an edge of the semiconductor chip by an interval;
a heat conductive adhesive formed in the heat conductive adhesive mounting area;
a heat dissipation member mounted on the heat conductive adhesive; and
an encapsulant formed between the chip carrier and the heat dissipation member and formed between the semiconductor chip and the heat dissipation member, and encapsulating the semiconductor chip and the heat conductive adhesive,
wherein the interval between the periphery of the heat conductive adhesive mounting area and the edge of the semiconductor chip falls in a range of ⅓ to ⅕ of an interval between a center and the edge of the semiconductor chip.

### Claim 2 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the chip carrier is one of a substrate and a lead frame.

### Claim 3 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the semiconductor chip has an active surface and an opposing non-active surface defined with the heat conductive adhesive mounting area, and is flip-chip mounted on and electrically connected to the chip carrier via the active surface of the semiconductor chip.

### Claim 4 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the semiconductor chip has an active surface defined with the heat conductive adhesive mounting area and an opposing non-active surface, the semiconductor chip is mounted on the chip carrier via the non-active surface of the semiconductor chip and electrically connected to the chip carrier by wire bonding.

### Claim 5 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the interval between the periphery of the heat conductive adhesive mounting area and the edge of the semiconductor chip is ¼ of the interval between the center and the edge of the semiconductor chip.

### Claim 6 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the heat conductive adhesive is made of epoxy of low elastic modulus.

### Claim 7 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the elastic modulus of the heat conductive adhesive is less than 1000 Mpa.

### Claim 8 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the glass transition temperature (Tg) of the heat conductive adhesive is lower than 25° C.

### Claim 9 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the heat conductive adhesive comprises a heat conductive material such that thermal conductivity coefficient of the heat conductive adhesive falls in a range of 2 to 5 w/m° K.

### Claim 10 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein the semiconductor chip has an active surface and an opposing non-active surface, and edges of the active surface and non-active surface and side edge of the semiconductor chip are embedded in the encapsulant, thereby increasing bonding area of the semiconductor chip and the encapsulant.

### Claim 11 (depends on 1)

The heat dissipation semiconductor package of claim 1, wherein edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination between different materials of the semiconductor package.