# US 7,608,914 B1 · Integrated circuit package with electrically isolated leads

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- Number: US 7,608,914 B1
- Document ID: US7608914B1
- Status: Granted
- Kind: B1
- Application number: 11/403,409
- Filed: 2006-04-12
- Granted: 2009-10-27
- Earliest claimed: 2006-04-12
- Assignees: Cypress Semiconductor Corporation
- Inventors: Brett Alan Spurlock; Carlo Melendez Gamboa; Bo Soon Chang
- Web page: https://patentgrep.com/patent/US7608914B1

## CPC

- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned such that they may be encapsulated by an electrically insulating packaging material on the back of the lead frame. Portions of the lead frame having external electrical connections may have a thickness such that they are exposed through the packaging material. The lead frame may be covered by an electrically insulating cover to protect components on the lead frame from erroneous electrical contact or electrostatic discharge (ESD) damage.

## Claims

### Claim 1

An integrated circuit packaging structure comprising:
a first die paddle portion and a second die paddle portion that are physically separated, the first die paddle portion being thicker than the second die paddle portion;
a first component mounted on the first die paddle portion;
a first set of leads, each lead in the first set of leads having an exposed portion and an isolated portion;
a second set of leads forming a single piece with the second die paddle portion;
an electrically insulating packaging material formed over the second set of leads, the isolated portions of the leads in the first set of leads, and the second die paddle portion such that the exposed portions of the leads in the second set of leads are exposed for external electrical connection through the packaging material; and
an electrically insulating cover covering a top and side of the second set of leads, the cover covering a top and a side of at least one lead in the first set of leads.

### Claim 2 (depends on 1)

The packaging structure of claim 1 wherein the packaging material comprises molding compound.

### Claim 3 (depends on 1)

The packaging structure of claim 1 wherein the first component comprises an integrated circuit die.

### Claim 4 (depends on 1)

The packaging structure of claim 1 further comprising:
a second component mounted on the second die paddle portion.

### Claim 5 (depends on 4)

The packaging structure of claim 4 wherein the second component comprises a vertical cavity surface emitting laser (VCSEL).

### Claim 6 (depends on 4)

The packaging structure of claim 4 further comprising:
a third die paddle portion that is physically separate from the first die paddle portion and the second die paddle portion, the third die paddle portion being buried under the packaging material, wherein at least one electrical connection from the second component to the first component is routed through the third die paddle portion.

### Claim 7 (depends on 6)

The packaging structure of claim 6 wherein the third die paddle portion includes a third set of leads forming a single piece with the third die paddle portion, wherein the third set of leads are buried under the packaging material.

### Claim 8 (depends on 6)

The packaging structure of claim 6 further comprising:
a node on the third die paddle portion;
a wire electrically coupling the second component to the first node; and
another wire electrically coupling the node to the first component.

### Claim 9 (depends on 1)

The packaging structure of claim 1 wherein the second set of leads, the isolated portion of each lead in the first set of leads, and the second die paddle portion have the same thickness that is thinner than that of the first die paddle portion and the exposed portion of each lead in the first set of leads.

### Claim 10 (depends on 9)

The packaging structure of claim 9 wherein the first die paddle portion and the exposed portion of each lead in the first set of leads have the same thickness.

### Claim 11 (depends on 10)

The packaging structure of claim 10 wherein the second set of leads, the isolated portion of each lead in the first set of leads, and the second die paddle portion have the same thickness that is half the thickness of the first die paddle portion and the exposed portion of each lead in the first set of leads.