# US 7,608,911 B2 · Semiconductor device package having a semiconductor element with a roughened surface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,911 B2 - Document ID: US7608911B2 - Status: Granted - Kind: B2 - Application number: 12/213,766 - Filed: 2008-06-24 - Published: 2008-10-30 - Granted: 2009-10-27 - Earliest claimed: 2004-03-25 - Assignees: Kabushiki Kaisha Toshiba - Inventors: Takashi Imoto; Chiaki Takubo; Ryuji Hosokawa; Yoshihisa Imori; Takao Sato; Tetsuya Kurosawa; Mika Kiritani - Web page: https://patentgrep.com/patent/US7608911B2 ## CPC - H10W 74/127: {characterised by arrangements for sealing or adhesion} - H10D 62/117: {Shapes of semiconductor bodies} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/134: {the encapsulations being in grooves in the semiconductor body} - H10W 20/48: Insulating materials thereof - H10W 20/495: {Capacitive arrangements or effects of, or between wiring layers} - H10W 70/655: Fan-out layouts - H10W 70/682: {comprising holes having chips therein} - H10W 70/685: comprising multiple insulating layers - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin. ## Claims ### Claim 1 A semiconductor device comprising: a ball grid array package having a first surface on which a plurality of metal balls are formed; and a semiconductor element mounted in the package; a laminated film formed of a plurality of insulating films being formed on an element formation surface of the semiconductor element, a peripheral portion of the laminated film being offset inwardly from a peripheral portion of the semiconductor element, and electrode pads of the semiconductor element being formed on the insulating films and connected to the semiconductor element through wirings formed between the insulating films, the electrode pads of the semiconductor element being electrically connected to wirings of the package; wherein a portion of the element formation surface of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element is removed to form an exposed portion, wherein an insulating resin covers the exposed portion of the semiconductor element and the peripheral portion of the laminated film. ### Claim 2 (depends on 1) A semiconductor device according to claim 1, wherein at least one of the insulating films of the laminated film formed on the surface of the semiconductor element has a dielectric constant of 2 or less. ### Claim 3 (depends on 1) A semiconductor device according to claim 1, wherein the removed portion of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element has a surface roughness of 3 μm or more. ### Claim 4 (depends on 1) A semiconductor device according to claim 1, wherein the element formation surface of the semiconductor element is in contact with a second surface of the package, the second surface being at the opposite side to the first surface of the package. ### Claim 5 (depends on 1) A semiconductor device according to claim 1, wherein the removed portion of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element has a width of 1 to 300 μm. ### Claim 6 (depends on 5) A semiconductor device according to claim 5, wherein the removed portion of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element has a width of 5 to 10 μm. ### Claim 7 (depends on 1) A semiconductor device according to claim 1, wherein the removed portion of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element has a depth of 1 μm or more. ### Claim 8 (depends on 1) A semiconductor device according to claim 1, further comprising a protecting film formed above the laminated film, wherein the protecting film has a refractivity larger than 1.5 when measured with an ellipsometer using a light beam having a wavelength of 365 nm. ### Claim 9 (depends on 8) A semiconductor device according to claim 8, further comprising an insulating film having a refractivity of 1.5 or less when measured with an ellipsometer using a light beam having a wavelength of 365 nm formed at a lower layer between the protecting film and the laminated film, and an insulating film having a refractivity of 1.5 or more when measured with an ellipsometer using a light beam having a wavelength of 365 nm formed at an upper layer between the protecting film and the laminated film. ### Claim 10 (depends on 1) A semiconductor device according to claim 1, wherein the semiconductor element is flip chip bonded to the package, and the electrode pads of the semiconductor element are directly connected to the wirings of the package. ### Claim 11 (depends on 1) A semiconductor device according to claim 1, wherein the electrode pads of the semiconductor element are electrically connected to the wirings of the package by conductive films. ### Claim 12 A semiconductor device comprising: a ball grid array package having a first surface on which a plurality of metal balls are formed; and a semiconductor element mounted in the package, a laminated film formed of a plurality of insulating films being formed on an element formation surface of the semiconductor element, a peripheral portion of the laminated film being offset inwardly from a peripheral portion of the semiconductor element, and electrode pads of the semiconductor element being formed on the insulating films and connected to the semiconductor element through wirings formed between the insulating films, the electrode pads of the semiconductor element being electrically connected to wirings of the package; wherein a portion of the element formation surface of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element is removed to form an exposed portion, wherein an insulation resin covers the exposed portion of the semiconductor element and the peripheral portion of the laminated film; and wherein the semiconductor element is mounted on the package in such a manner that the element formation surface of the semiconductor element is turned away from a second surface of the package, the second surface being at the opposite side to said first surface of the package, and the electrode pads of the semiconductor element are electrically connected to the wirings of the package by bonding wires. ### Claim 13 A semiconductor device comprising: a ball grid array package having a first surface on which a plurality of metal balls are formed; and a semiconductor element mounted in the package, a laminated film formed of a plurality of insulating films being formed on an element formation surface of the semiconductor element, a peripheral portion of the laminated film being offset inwardly from a peripheral portion of the semiconductor element, and electrode pads of the semiconductor element being formed on the insulating films and connected to the semiconductor element through wirings formed between the insulating films, the electrode pads of the semiconductor element being electrically connected to wirings of the package; wherein a portion of the element formation surface of the semiconductor element which is between the peripheral portion of the laminated film and the peripheral portion of the semiconductor element is removed to form an exposed portion, wherein an insulating resin covers the exposed portion of the semiconductor element and the peripheral portion of the laminated film; and wherein the electrode pads of the semiconductor element are electrically connected to the wirings of the package by bonding wires.