# US 7,608,789 B2 · Component arrangement provided with a carrier substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,789 B2 - Document ID: US7608789B2 - Status: Granted - Kind: B2 - Application number: 11/573,610 - Filed: 2004-08-02 - Published: 2008-02-14 - Granted: 2009-10-27 - Earliest claimed: 2004-08-02 - Assignees: Epcos AG - Inventors: Hans Krüger; Alois Stelzl - Web page: https://patentgrep.com/patent/US7608789B2 ## CPC - H10W 70/685: comprising multiple insulating layers - H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00) - H10W 70/69: Insulating materials thereof - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 428/12375: having member which crosses the plane of another member [e.g., T or X cross section, etc.] - Y10T 428/12486: Laterally noncoextensive components [e.g., embedded, etc.] - Y10T 428/23: Sheet including cover or casing - Y10T 428/24: Structurally defined web or sheet [e.g., overall dimension, etc.] - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate. ## Claims ### Claim 1 A component arrangement comprising: a carrier substrate; a component on the carrier substrate; and a cover layer on the carrier substrate, the cover layer being over the component and forming a seal with the carrier substrate to seal the component; wherein the carrier substrate comprises: at least two layers of glass film, the at least two layers of glass film comprising a first glass film and a second glass film, and an intermediate layer over the first glass film; wherein a recess in the carrier substrate extends along an exterior of the component, the recess extending through the first glass film from a side of the carrier substrate facing the component to a contact plane; wherein the contact plane comprises the second glass film and a metallization on the second glass film; and wherein the cover layer is electrically connected to the metallization that is part of the contact plane. ### Claim 2 (depends on 1) The component arrangement of claim 1, wherein the carrier substrate comprises a composite comprised of glass film and a low temperature co-fire ceramic. ### Claim 3 (depends on 1) The component arrangement of claim 1, wherein the carrier substrate comprises a multilayer substrate. ### Claim 4 (depends on 3) The component arrangement of claim 3, wherein the multilayer substrate comprises low temperature co-fire ceramic. ### Claim 5 (depends on 1) The component arrangement of claim 1, wherein the component comprises a module. ### Claim 6 (depends on 1) The component arrangement of claim 1, wherein the component is mounted over the at least two layers of glass film. ### Claim 7 (depends on 1) The component arrangement of claim 1, further comprising: a chip comprising a component structure. ### Claim 8 (depends on 1) The component arrangement of claim 1, further comprising: a chip comprising a surface acoustic wave component. ### Claim 9 (depends on 1) The component arrangement of claim 1, wherein the cover layer has metallic characteristics. ### Claim 10 (depends on 1) The component arrangement of claim 1, wherein the cover layer comprises a glob top made from thermosetting resin. ### Claim 11 (depends on 1) The component arrangement of claim 1, further comprising: a contact element on a bottom of the carrier substrate; wherein the contact element is electrically connected to the component. ### Claim 12 (depends on 11) The component arrangement of claim 11, wherein the carrier substrate comprises a feedthrough contact that extends from a first side of the carrier substrate nearest to the component towards the bottom of the carrier substrate. ### Claim 13 (depends on 11) The component arrangement according to claim 11, wherein the carrier substrate comprises feedthrough contacts that extend through at least two layers of glass film to the contact element, the feed through contacts being offset from each other. ### Claim 14 (depends on 1) The component arrangement of claim 1, wherein the carrier substrate comprises a first metallic contact surface, and the component comprises a second metallic contact surface; and wherein the component arrangement comprises an electrical connection between the first metallic contact surface and the second metallic contact surface, the electrical connection comprising bumps. ### Claim 15 (depends on 1) The component arrangement of claim 1, which has a hollow space between the component and the carrier substrate, the hollow space being formed by the cover layer sealing to the carrier substrate. ### Claim 16 (depends on 14) The component arrangement of claim 14, further comprising a mask layer in a region around the bumps, the mask layer substantially covering the first metallic contact surfaces. ### Claim 17 (depends on 1) The component of claim 1, wherein a thickness of the first glass film, which is adjacent to the component, is less than a thickness of a layer of glass film that is not adjacent to the component. ### Claim 18 (depends on 17) The component arrangement of claim 17, wherein a thickness of the layer of glass film that is not adjacent to the component is between 50 μm to 100 μm. ### Claim 19 (depends on 1) The component of claim 1, wherein a ground connection of the component is electrically connected to the cover layer. ### Claim 20 (depends on 1) The component arrangement of claim 1, wherein the carrier substrate is multilayered; and wherein passive components are integrated in the carrier substrate, the passive components being electrically connected to the component to form a circuit structure.