# US 7,608,788 B2 · Plating buss and a method of use thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,788 B2 - Document ID: US7608788B2 - Status: Granted - Kind: B2 - Application number: 11/869,204 - Filed: 2007-10-09 - Published: 2008-01-31 - Granted: 2009-10-27 - Earliest claimed: 2004-06-04 - Assignees: Micron Technology, Inc. - Inventors: Mark S. Johnson - Web page: https://patentgrep.com/patent/US7608788B2 ## CPC - H05K 3/242: {characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated} - H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards} - H05K 2201/09263: Meander - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49126: Assembling bases - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield. ## Claims ### Claim 1 A substrate panel comprising: a plurality of printed circuit boards suitable for singulation using a saw blade having a width defining a first process window, each printed circuit board having a plurality of conductive traces provided on a planar surface of the substrate, wherein said plurality of conductive traces on one of said plurality of printed circuit boards is offset from said plurality of conductive traces on an adjacent one of said plurality of printed circuit boards; and a serpentine plating buss provided on said planar surface between adjacent ones of said plurality of printed circuit boards and interconnecting said plurality of offset conductive traces, and wherein said serpentine plating buss comprises a plurality of lateral segments positioned perpendicularly across said first process window, and a plurality of nonparallel side segments, wherein said serpentine plating buss extends laterally in a full pattern a distance greater than the width of the saw blade such that said serpentine plating bus defines a second process window significantly larger than the first process window. ### Claim 2 (depends on 1) The substrate panel of claim 1 wherein the serpentine plating buss is provided in an accordion pattern. ### Claim 3 (depends on 1) The substrate panel of claim 1 wherein the serpentine plating buss is continuous from one end of the substrate panel to another end of the substrate panel. ### Claim 4 (depends on 1) The substrate panel of claim 1 wherein the serpentine plating buss is non-continuous from one end of the substrate panel to another end of the substrate panel. ### Claim 5 (depends on 1) The substrate panel of claim 1 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a saw toothed pattern. ### Claim 6 (depends on 1) The substrate panel of claim 1 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a triangular pattern. ### Claim 7 (depends on 1) The substrate panel of claim 1 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a curvilinear pattern. ### Claim 8 (depends on 1) The substrate panel of claim 1 wherein the plurality of nonparallel side segments of the serpentine plating buss are provided in a pattern selected from the group comprising accordion, saw toothed, triangular, curvilinear pattern, and combinations thereof. ### Claim 9 (depends on 1) The substrate panel of claim 1 wherein the substrate panel further comprises a plurality of various sized holes. ### Claim 10 A substrate panel comprising: a plurality of printed circuit boards suitable for singulation using a saw blade having a width defining a first process window, each printed circuit board having a plurality of conductive traces provided on a planar surface of the substrate, wherein said plurality of conductive traces on one of said plurality of printed circuit boards is offset from said plurality of conductive traces on an adjacent one of said plurality of printed circuit boards; a serpentine plating buss provided on said planar surface between adjacent ones of said plurality of printed circuit boards and interconnecting said plurality of offset conductive traces, and wherein said serpentine plating buss comprises a plurality of lateral segments positioned perpendicularly across said first process window, and a plurality of nonparallel side segments, wherein said serpentine plating buss extends laterally in a full pattern a distance greater than the width of the saw blade such that said serpentine plating bus defines a second process window significantly larger than the first process window; and the plurality of nonparallel side segments of said serpentine plating buss are provided in a pattern selected from the group comprising accordion, saw toothed, triangular, curvilinear pattern, and combinations thereof. ### Claim 11 (depends on 10) The substrate panel of claim 10 wherein the serpentine plating buss is provided in an accordion pattern. ### Claim 12 (depends on 10) The substrate panel of claim 10 wherein the serpentine plating buss is continuous from one end of the substrate panel to another end of the substrate panel. ### Claim 13 (depends on 10) The substrate panel of claim 10 wherein the serpentine plating buss is non-continuous from one end of the substrate panel to another end of the substrate panel. ### Claim 14 (depends on 10) The substrate panel of claim 10 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a saw toothed pattern. ### Claim 15 (depends on 10) The substrate panel of claim 10 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a triangular pattern. ### Claim 16 (depends on 10) The substrate panel of claim 10 wherein the plurality of nonparallel side segments of the serpentine plating buss is provided in a curvilinear pattern. ### Claim 17 (depends on 10) The substrate panel of claim 10 wherein the substrate panel further comprises a plurality of various sized holes.