# US 7,608,787 B2 · Semiconductor memory device and USB memory device using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,787 B2 - Document ID: US7608787B2 - Status: Granted - Kind: B2 - Application number: 11/531,589 - Filed: 2006-09-13 - Published: 2007-03-22 - Granted: 2009-10-27 - Earliest claimed: 2005-09-16 - Assignees: Kabushiki Kaisha Toshiba - Inventors: Yasuo Takemoto; Naohisa Okumura; Taku Nishiyama; Takashi Okada - Web page: https://patentgrep.com/patent/US7608787B2 ## CPC - H05K 5/0278: {of USB type (details relating to connectors H01R27/00)} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/10159: Memory - H05K 2201/10325: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support - H05K 2201/10492: Electrically connected to another device - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/732: {between stacked chips} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the memory element is sealed with a sealing resin. A semiconductor memory device as a USB memory main body is constituted by them. A USB memory is constituted by housing the USB memory main body inside of a USB connector case. ## Claims ### Claim 1 A USB memory device, comprising: a semiconductor memory device, including: a circuit board having a first principle surface and a second principle surface at an opposite side of the first principle surface; a USB terminal formed on the first principle surface of the circuit board, and having a conductor layer to be an input/output terminal of a USB connector; a memory element mounted on the second principle surface of the circuit board; a sealing resin provided on the second principle surface of the circuit board so as to seal the memory element; and an electronic component mounted on at least one of a region except a forming region of the USB terminal on the first principle surface of the circuit board and a region except a mounting region of the memory element on the second principle surface of the circuit board; and a USB connector case to which at least a part of the semiconductor memory device is housed, having an upper wall facing with the first principle surface of the circuit board, a lower wall facing with the second principle surface of the circuit board, and side walls, wherein the USB connector case has a projection projecting and folding a cut portion formed by cutting into a part of the upper wall toward the first principle surface of the circuit board, and being in contact with at least one of the first principle surface of the circuit board and the electronic component. ### Claim 2 (depends on 1) The USB memory device according to claim 1, wherein the semiconductor memory device further includes a controller element arranged on the second principle surface of the circuit board, and sealed with the sealing resin together with the memory element. ### Claim 3 (depends on 2) The USB memory device according to claim 2, wherein the controller element is stacked on the memory element. ### Claim 4 (depends on 2) The USB memory device according to claim 2, wherein the controller element is mounted on the second principle surface of the circuit board so as to be parallel arranged with the memory element. ### Claim 5 (depends on 1) The USB memory device according to claim 1, wherein the cut portion has a folding angle of an acute angle so that the projection projects in an oblique direction, and the projection is brought into contact with the electronic component. ### Claim 6 (depends on 1) The USB memory device according to claim 1, wherein the USB connector case is solder joined with at least one of a land provided on the first principle surface and the electronic component mounted on the first principle surface of the circuit board. ### Claim 7 (depends on 6) The USB memory device according to claim 6, wherein the USB connector case has a claw portion formed by cutting into a part thereof, and the claw portion is folded toward the circuit board and solder joined with at least one of the land and the electronic component. ### Claim 8 (depends on 7) The USB memory device according to claim 7, wherein the USB connector case has a first claw portion solder joined with the land connected to the ground wiring of the circuit board, and a second claw portion solder joined with an electrode of the electronic component. ### Claim 9 A USB memory device, comprising: a semiconductor memory device, including: a circuit board having a first principle surface and a second principle surface at an opposite side of the first principle surface; a USB terminal formed on the first principle surface of the circuit board, and having a conductor layer to be an input/output terminal of a USB connector; a memory element mounted on the second principle surface of the circuit board; a sealing resin provided on the second principle surface of the circuit board so as to seal the memory element; and an electronic component mounted on at least one of a region except the forming region of the USB terminal on the first principle surface of the circuit board and a region except the mounting region of the memory element on the second principle surface of the circuit board; and a USB connector case to which at least a part of the semiconductor memory device is housed, having an upper wall facing with the first principle surface of the circuit board, a lower wall facing with the second principle surface of the circuit board, and side walls, wherein the USB connector case has a projection projecting and folding a cut portion formed by cutting into a part of the side walls toward the first principle surface of the circuit board, and being in contact with at least one of the first principle surface of the circuit board and the electronic component. ### Claim 10 (depends on 9) The USB memory device according to claim 9, wherein the projection is brought into contact with the first principle surface of the circuit board. ### Claim 11 (depends on 9) The USB memory device according to claim 9, wherein the projection is solder joined with a land provided on the first principle surface of the circuit board. ### Claim 12 (depends on 11) The USB memory device according to claim 11, wherein the land is connected to a ground wiring of the circuit board, and the USB connector case constitutes a part of the ground wiring. ### Claim 13 (depends on 9) The USE memory device according to claim 9, wherein the semiconductor memory device further includes a controller element arranged on the second principle surface of the circuit board, and sealed with the sealing resin together with the memory element. ### Claim 14 (depends on 13) The USB memory device according to claim 13, wherein the controller element is stacked on the memory element. ### Claim 15 (depends on 13) The USB memory device according to claim 13, wherein the controller element is mounted on the second principle surface of the circuit board so as to be parallel arranged with the memory element. ### Claim 16 A USB memory device, comprising: a semiconductor memory device, including: a circuit board having a first principle surface and a second principle surface at an opposite side of the first principle surface; a USB terminal formed on the first principle surface of the circuit board, and having a conductor layer to be an input/output terminal of a USB connector; a memory element mounted on the second principle surface of the circuit board; and a sealing resin provided on the second principle surface of the circuit board so as to seal the memory element; and a USB connector case to which at least a part of the semiconductor memory device is housed, having an upper wall facing with the first principle surface of the circuit board, a lower wall facing with the second principle surface of the circuit board, and side walls, wherein the USB connector case has a projection projecting and folding a cut portion formed by cutting into a part of the side walls toward the first principle surface of the circuit board, and being in contact with the first principle surface of the circuit board. ### Claim 17 (depends on 16) The USB memory device according to claim 16, wherein the projection is solder joined with a land provided on the first principle surface of the circuit board. ### Claim 18 (depends on 17) The USB memory device according to claim 17, wherein the land is connected to a ground wiring of the circuit board, and the USB connector case constitutes a part of the ground wiring. ### Claim 19 (depends on 16) The USB memory device according to claim 16, wherein the semiconductor memory device further includes a controller element arranged on the second principle surface of the circuit board, and sealed with the sealing resin together with the memory element. ### Claim 20 (depends on 19) The USB memory device according to claim 19, wherein the controller element is stacked on the memory element. ### Claim 21 (depends on 19) The USB memory device according to claim 19, wherein the controller element is mounted on the second principle surface of the circuit board so as to be parallel arranged with the memory element.