# US 7,608,487 B2 · B-stageable underfill encapsulant and method for its application

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- Number: US 7,608,487 B2
- Document ID: US7608487B2
- Status: Granted
- Kind: B2
- Application number: 11/284,219
- Filed: 2005-11-21
- Published: 2006-06-15
- Granted: 2009-10-27
- Earliest claimed: 2002-03-01
- Assignees: Henkel AG & Co. KGaA
- Inventors: Allison Yue Xiao; Quinn K. Tong; Bodan Ma; Gyanendra Dutt
- Web page: https://patentgrep.com/patent/US7608487B2

## CPC

- C08G 59/686: {containing nitrogen}
- C08G 59/5093: {Complexes of amines}
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 72/01331: {using blanket deposition}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

## Claims

### Claim 1

A method of preparing one or more silicon chips, comprising the steps of
a) applying to a semiconductor wafer an encapsulant comprising a thermally curable admixture of an epoxy resin having an epoxy equivalent weight between 86 g/eg and 700 g/eg, a phenol-containing compound, an imidazole phosphate salt catalyst, and a fluxing agent;
b) B-stage processing the encapsulant on the semiconductor wafer so that the encapsulant solidifies into a smooth, non-tacky coating; and
c) dicing the semiconductor wafer into individual silicon chips.

### Claim 2 (depends on 1)

The method of claim 1, wherein the encapsulant is applied to the semiconductor wafer via spin coating, screen printing or stencil printing.

### Claim 3

A method of preparing an electronic package comprising the steps of
a) applying to a semiconductor wafer an encapsulant comprising a thermally curable admixture of an epoxy resin having an epoxy equivalent weight between 86 g/eg and 700 g/eg, a phenol-containing compound, an imidazole phosphate salt catalyst, and a fluxing agent;
b) B-stage processing the encapsulant on the semiconductor wafer so that the encapsulant solidifies into a smooth, non-tacky coating;
c) dicing the semiconductor wafer into more than one silicon chip, with each chip having a first side coated with the encapsulant;
d) placing one or more silicon chips on a substrate so that the first side of the silicon chip is adjacent to the substrate; and
e) heating the substrate and at least one silicon chip to a temperature sufficient to form interconnections between the at least one silicon chip and the substrate and cure the encapsulant.

### Claim 4 (depends on 3)

The method of claim 3, comprising the additional step of placing an unfilled liquid curable fluxing material on the substrate before the silicon chip is placed on the substrate.

### Claim 5 (depends on 1)

The encapsulant of claim 1, wherein the imidazole phosphate salt comprises 2-phenylimidazole dihydrogen phosphate salt.

### Claim 6 (depends on 5)

The encapsulant of claim 5, wherein the imidazole phosphate salt comprises a phosphoric acid component.