# US 7,608,328 B2 · Water-permeable adhesive tape > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,328 B2 - Document ID: US7608328B2 - Status: Granted - Kind: B2 - Application number: 11/650,450 - Filed: 2007-01-08 - Published: 2007-05-17 - Granted: 2009-10-27 - Earliest claimed: 2000-03-30 - Assignees: Nitto Denko Corporation; Nitto Europe N.V. - Inventors: Walter Eevers; Ann Issaris; Yoshiaki Mitsuoka; Edwin Thys; Yuuzou Akada - Web page: https://patentgrep.com/patent/US7608328B2 ## CPC - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7416: {used during dicing or grinding} - Y10T 428/15: Sheet, web, or layer weakened to permit separation through thickness - Y10T 428/24273: including aperture - Y10T 428/249958: Void-containing component is synthetic resin or natural rubbers - Y10T 428/249984: Adhesive or bonding component contains voids - Y10T 428/28: Web or sheet containing structurally defined element or component and having an adhesive outermost layer - Y10T 428/2813: Heat or solvent activated or sealable - Y10T 428/2826: Synthetic resin or polymer - Y10T 428/2857: including metal or compound thereof or natural rubber - Y10T 442/2713: Halogen containing - Y10T 442/2738: Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith - Y10T 442/2746: Heat-activatable adhesive - Y10T 442/2754: Pressure-sensitive adhesive - Y10T 442/60: Nonwoven fabric [i.e., nonwoven strand or fiber material] - Y10T 442/674: Nonwoven fabric with a preformed polymeric film or sheet - Y10T 442/679: Natural or synthetic rubber sheet or film - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology. ## Claims ### Claim 1 An adhesive tape for processing semiconductor wafers and/or semiconductor related materials, comprising (i) an adhesive tape and (ii) a semiconductor wafer or a semiconductor material affixed to the adhesive tape, the adhesive tape comprising at least one water-permeable base film and an adhesive applied only on one surface of the at least one water-permeable base film, and the at least one water-permeable base film possesses perforations and has a cavity ratio of 3.0 to 90%. ### Claim 2 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive applied on one surface of the at least one water-permeable base film does not have perforations. ### Claim 3 (depends on 1) The adhesive tape according to claim 1, wherein the semiconductor wafer or semiconductor material of the combination is processed by a laser beam guided by a water stream. ### Claim 4 (depends on 1) The adhesive tape according to claim 1, wherein the at least one water-permeable base film comprises a synthetic resin or a non-woven fabric. ### Claim 5 (depends on 1) The adhesive tape according to claim 1, wherein the perforations range in size from 0.001 to 3.0 mm2. ### Claim 6 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive applied on one surface of the at least one water-permeable base film comprises a rubber-based or acrylic-based adhesive. ### Claim 7 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive applied on one surface of the at least one water-permeable base film is pressure-sensitive, light-sensitive and/or heat-sensitive. ### Claim 8 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive tape has an elongation of more than 10%. ### Claim 9 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive tape has a tensile strength of more than 0.1 N/20 mm. ### Claim 10 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive tape has an adhesive strength of 0.15 to 10 N/20 mm. ### Claim 11 (depends on 1) The adhesive tape according to claim 1, wherein the perforations are artificial perforations. ### Claim 12 (depends on 1) The adhesive tape according to claim 1, wherein the perforations are artificial perforations and has a cavity ratio of 3 to 60%. ### Claim 13 (depends on 1) The adhesive tape according to claim 1, wherein the perforations are artificial perforations and has a cavity ratio of 10 to 55%. ### Claim 14 (depends on 1) The adhesive tape according to claim 1, wherein the at least one water-permeable base film possesses artificial perforations and has a cavity ratio of 20 to 50%. ### Claim 15 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive comprises a rubber-based or acrylic-based adhesive. ### Claim 16 (depends on 1) The adhesive tape according to claim 1, wherein the adhesive is pressure-sensitive, light-sensitive and/or heat-sensitive. ### Claim 17 An adhesive tape for processing semiconductor wafers and/or semiconductor related materials, comprising (i) an adhesive tape and (ii) a semiconductor wafer or a semiconductor material affixed to the adhesive tape, the adhesive tape comprising at least one water-permeable base film and an adhesive applied on one surface of the at least one water-permeable base film, and the at least one water-permeable base film possesses artificial perforations and has a cavity ratio of 3 to 60%. ### Claim 18 (depends on 17) The adhesive tape according to claim 17, wherein the at least one water-permeable base film possesses artificial perforations and has a cavity ratio of 10 to 55%. ### Claim 19 (depends on 17) The adhesive tape according to claim 17, wherein the at least one water-permeable base film possesses artificial perforations and has a cavity ratio of 20 to 50%.