# US 7,608,324 B2 · Interface materials and methods of production and use thereof

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- Number: US 7,608,324 B2
- Document ID: US7608324B2
- Status: Granted
- Kind: B2
- Application number: 10/465,968
- Filed: 2002-05-30
- Published: 2007-05-03
- Granted: 2009-10-27
- Earliest claimed: 2002-05-30
- Assignees: Honeywell International Inc.
- Inventors: My N. Nguyen; Nancy Dean; Kenishiro Fukuyama
- Web page: https://patentgrep.com/patent/US7608324B2

## CPC

- D04H 11/00: Non-woven pile fabrics (layered products forming non-woven pile fabrics B32B)
- D04H 1/42: characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- F28F 2013/006: {Heat conductive materials}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/249924: Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T 428/25: Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T 428/253: Cellulosic [e.g., wood, paper, cork, rayon, etc.]
- Y10T 428/31504: Composite [nonstructural laminate]
- D04H: MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL (weaving D03; knitting D04B; braiding D04C; net-making D04G; sewing D05B; tufting D05C; finishing non-woven fabrics D06); FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING {; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION}(non-woven fabrics having an intermediate or external layer of a different kind, e.g. of woven fabric, B32B)
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.

## Claims

### Claim 1

A layered interface material, comprising:
at least one crosslinkable thermal interface component; and
at least one compliant fibrous interface component coupled to the thermal interface component.

### Claim 2 (depends on 1)

The layered interface material of claim 1, wherein the at least one thermal interface component comprises at least one rubber compound, at least one amine resin and at least one thermally conductive filler.

### Claim 3 (depends on 2)

The layered interface material of claim 2, wherein the at least one thermal interface component further comprises at least one phase change material.

### Claim 4 (depends on 2)

The layered interface material of claim 2, wherein the at least one rubber compound comprises at least one terminal hydroxy group.

### Claim 5 (depends on 2)

The layered interface material of claim 2, wherein the at least one rubber compound comprises at least one saturated compound.

### Claim 6 (depends on 4)

The layered interface material of claim 4, wherein the at least one rubber compound further comprises at least one saturated compound.

### Claim 7 (depends on 4)

The layered interface material of claim 4, wherein the at least one rubber compound comprises hydrogenated polyalkyldiene mono-ol, hydrogenated polyalkyldiene diol, or a combination or mixture thereof.

### Claim 8 (depends on 7)

The layered interface material of claim 7, wherein the hydrogenated polyalkyldiene mono-ol comprises hydrogenated polybutadiene mono-ol.

### Claim 9 (depends on 7)

The layered interface material of claim 7, wherein the hydrogenated polyalkyldiene diol comprises hydrogenated polybutadiene diol.

### Claim 10 (depends on 2)

The layered interface material of claim 2, wherein the at least one amine resin comprises a melamine resin.

### Claim 11 (depends on 10)

The layered interface material of claim 10, wherein the melamine resin comprises an alkylated melamine resin.

### Claim 12 (depends on 11)

The layered interface material of claim 11, wherein the alkylated melamine resin comprises butylated melamine resin.

### Claim 13 (depends on 2)

The layered interface material of claim 2, wherein the at least one thermally conductive filler comprises a metal powder, a boron nitride compound or a combination thereof.

### Claim 14 (depends on 13)

The layered interface material of claim 13, wherein the metal powder comprises aluminum powder, silver powder, copper powder or a combination thereof.

### Claim 15 (depends on 3)

The layered interface material of claim 3, wherein the at least one phase change material comprises a wax.

### Claim 16 (depends on 15)

The layered interface material of claim 15, wherein the wax comprises a paraffin wax.

### Claim 17 (depends on 2)

The layered interface material of claim 2, further comprising at least one catalytic material.

### Claim 18 (depends on 3)

The layered interface material of claim 3, further comprising at least one catalytic material.

### Claim 19 (depends on 1)

The layered interface material of claim 1, wherein the compliant fibrous interface component comprises a plurality of flocked thermally conductive fibers.

### Claim 20 (depends on 19)

The layered interface material of claim 19, wherein the plurality of flocked thermally conductive fibers are embedded in an adhesive material.

### Claim 21 (depends on 20)

The layered material of claim 20, wherein the plurality of flocked thermally conductive fibers are embedded in a substantially vertical orientation with portions of the plurality of fibers extending out of the adhesive material.

### Claim 22 (depends on 21)

The layered material of claim 21, wherein the plurality of flocked thermally conductive fibers comprise an encapsulant material disposed between the portions of the plurality of fibers, wherein the plurality of fibers extends out of the encapsulant material.

### Claim 23 (depends on 19)

The layered material of claim 19, wherein the plurality of flocked thermally conductive fibers comprises carbon, graphite, metal, ceramic, conductive polymer, diamond or a combination thereof.

### Claim 24 (depends on 23)

The layered material of claim 23, wherein the plurality of flocked thermally conductive fibers comprises carbon.

### Claim 25 (depends on 19)

The layered material of claim 19, wherein the plurality of flocked thermally conductive fibers comprises a length of at least about 0.0005 inches.

### Claim 26 (depends on 25)

The layered material of claim 25, wherein the plurality of flocked thermally conductive fibers comprises a length of at least about 0.001 inches.

### Claim 27 (depends on 26)

The layered material of claim 26, wherein the plurality of flocked thermally conductive fibers comprises a length of at least about 0.01 inches.

### Claim 28 (depends on 27)

The layered material of claim 27, wherein the plurality of flocked thermally conductive fibers comprises a length of at least about 0.1 inches.

### Claim 29 (depends on 28)

The layered material of claim 28, wherein the plurality of flocked thermally conductive fibers comprises a length of at least about 1 inch.

### Claim 30 (depends on 19)

The layered material of claim 19, wherein the plurality of flocked thermally conductive fibers comprises a fiber diameter of at least about 3 microns.

### Claim 31 (depends on 30)

The layered material of claim 30, wherein the plurality of flocked thermally conductive fibers comprises a fiber diameter of at least about 30 microns.

### Claim 32 (depends on 31)

The layered material of claim 31, wherein the plurality of flocked thermally conductive fibers comprises a fiber diameter of at least about 300 microns.

### Claim 33 (depends on 19)

The layered material of claim 19, wherein the encapsulant comprises a gel material.

### Claim 34 (depends on 33)

The layered material of claim 33, wherein the gel material comprises a silicon gel, a spray gasket material or a combination thereof.

### Claim 35 (depends on 19)

The layered material of claim 19, wherein the plurality of thermally conductive fibers comprises a thermal conductivity of at least about 25 W/mK.

### Claim 36 (depends on 1)

A layered component comprising the layered interface material of claim 1.

### Claim 37 (depends on 1)

An electronic component comprising the layered interface material of claim 1.

### Claim 38 (depends on 2)

A layered component comprising the layered interface material of claim 2.

### Claim 39 (depends on 2)

An electronic component comprising the layered interface material of claim 2.

### Claim 40 (depends on 3)

A layered component comprising the layered interface material of claim 3.

### Claim 41 (depends on 3)

An electronic component comprising the layered interface material of claim 3.

### Claim 42 (depends on 3)

A tape comprising the layered interface material of claim 3.

### Claim 43

A method of producing a layered interface material, comprising:
providing a crosslinkable thermal interface component;
providing a compliant fibrous interface component; and
physically coupling the thermal interface component and the compliant fibrous interface component.

### Claim 44 (depends on 43)

A method of forming the crosslinkable thermal interface component of claim 43, comprising:
providing at least one saturated rubber compound;
providing at least one amine resin;
crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture;
adding at least one thermally conductive filler to the crosslinked rubber-resin mixture; and
adding a wetting agent to the crosslinked rubber-resin mixture.

### Claim 45 (depends on 44)

The method of claim 44, further comprising adding at least one phase change material to the crosslinked rubber-resin mixture.

### Claim 46 (depends on 45)

A liquid thermal interface composition formed by the method of claim 45.

### Claim 47 (depends on 45)

A solid thermal interface composition formed by the method of claim 45.

### Claim 48 (depends on 45)

A tape comprising the thermal interface component of claim 45.

### Claim 49 (depends on 43)

A method of forming the compliant fibrous interface component of claim 43, comprising:
providing thermally conductive fibers having a length;
providing a substrate;
applying adhesive to the substrate;
flocking the fibers to the substrate;
embedding the fibers into the adhesive with a portion of the fibers extending out of the adhesive;
curing the adhesive;
disposing a curable encapsulant between the fibers extending out of the adhesive and beneath the free ends of the fibers;
compressing the fibers with encapsulant between the fibers into the adhesive; and
curing the encapsulant while under compression.