# US 7,608,295 B2 · Polyimide compositions and use thereof in ceramic product defect repair

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- Number: US 7,608,295 B2
- Document ID: US7608295B2
- Status: Granted
- Kind: B2
- Application number: 11/684,679
- Filed: 2007-03-12
- Published: 2007-07-05
- Granted: 2009-10-27
- Earliest claimed: 2003-01-08
- Assignees: International Business Machines Corporation
- Inventors: Krishna G Sachdev; Michael Berger; Gregg Monjeau; Robert A. Rita; Kathleen M Wiley
- Web page: https://patentgrep.com/patent/US7608295B2

## CPC

- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- C03C 17/32: with synthetic or natural resins (C03C17/30 takes precedence)
- C04B 41/009: {characterised by the material treated}
- C04B 41/488: {Other macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds}
- C04B 41/83: Macromolecular compounds
- C08G 73/10: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G 73/1014: {in the form of (mono)anhydrid}
- C08G 73/1017: {in the form of (mono)amine}
- C08G 73/1039: {comprising halogen-containing substituents}
- C08G 73/1042: {Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds}
- C08G 73/1067: {Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound}
- C08G 73/1075: {Partially aromatic polyimides}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- C04B 2111/00844: {for electronic applications}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/225: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)}
- H05K 2201/0154: Polyimide
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

## Claims

### Claim 1

A method of repairing a ceramic substrate comprising the steps of:
providing a ceramic substrate having a defect;
coating the defect region with a polyamic acid composition comprising an aromatic diamine monomer and an aromatic dianhydride monomer, where both of the monomers are flexible and a stoichiometric excess of one of the monomers is used, and subsequently endcapping with an amine or anhydride depending on which monomer was used in excess, and wherein the dianhydride monomer is oxydiphthalic anhydride (ODPA) and the aromatic diamine monomer is 1,3-bis(3′-aminophenoxy)benzene (1,3,3′-APB) or the dianhydride monomer is ODPA and the diamine monomer is a mixture of 1,3,3′-APB and one or both of 4,4′-oxydianiline (4,4′-ODA) and 3,4′-oxydianiline (3,4′-ODA); and
curing the polyamic acid coating to form a flexible polyimide.

### Claim 2 (depends on 1)

The method of claim 1 wherein the defect is a surface defect or an internal structure defect.

### Claim 3 (depends on 1)

The method of claim 1 wherein the polyamic acid composition is applied in multiple applications with curing or partial curing of the applied polyamic composition before the next application.

### Claim 4 (depends on 3)

The method of claim 3 wherein a flexible chain polyamic acid composition is first applied to the defect, partially cured and then followed by a semi-flexible-planar chain polyamic acid composition, after which the polyamic acid is fully cured.

### Claim 5 (depends on 1)

The method of claim 1 wherein the polyamic acid composition is in a n-methyl pyrrolidone solvent.

### Claim 6 (depends on 1)

The method of claim 1 wherein the polyamic acid composition further contains xylene.

### Claim 7 (depends on 1)

The method of claim 1 wherein the polyamic acid composition further contains a coloring agent.

### Claim 8 (depends on 1)

The method of claim 1 wherein the polyamic composition further contains an inorganic filler.