# US 7,608,204 B2 · Conductive ink composition and method of forming a conductive pattern using the same

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- Number: US 7,608,204 B2
- Document ID: US7608204B2
- Status: Granted
- Kind: B2
- Application number: 12/018,892
- Filed: 2008-01-24
- Published: 2008-10-02
- Granted: 2009-10-27
- Earliest claimed: 2007-03-30
- Assignees: Samsung Electronics Co., Ltd.
- Inventors: Jang-Sub Kim; Soon-Kwon Lim; Joo-Ho Moon; Sun-Ho Jeong; Dong-Jo Kim; Kyoo-Hee Woo
- Web page: https://patentgrep.com/patent/US7608204B2

## CPC

- H01B 1/22: the conductive material comprising metals or alloys
- C09D 11/36: based on non-aqueous solvents
- C09D 11/52: Electrically conductive inks
- H05K 1/097: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A conductive ink composition includes about 15% to about 50% by weight of copper nanoparticles, about 40% to about 80% by weight of a non-aqueous solvent mixture, about 0.01% to about 5% by weight of a dispersion agent and about 1% to about 20% by weight of a wetting agent. A conductive pattern may be formed with use of the conductive ink composition and an inkjet printer.

## Claims

### Claim 1

A conductive ink composition comprising:
about 40% to about 80% by weight of a non-aqueous solvent mixture comprising a first solvent having a viscosity of about 0.1 mPa·s to about 5 mPa·s at about 25° C., a second solvent having a viscosity of about 15 mPa·s to about 40 mPa·s at about 25° C., and a third solvent having a vapor pressure of about 10 mmHg to about 250 mmHg at about 25° C.;
about 15% to about 50% by weight of copper nanoparticles;
about 0.01% to about 5% by weight of a dispersion agent; and
about 1% to about 20% by weight of a wetting agent.

### Claim 2 (depends on 1)

The conductive ink composition of claim 1, wherein the first solvent comprises at least one selected from the group consisting of 2-methoxy ethanol, propyl alcohol, pentyl alcohol, hexyl alcohol, butyl alcohol, octyl alcohol, formamide and methyl ethyl ketone.

### Claim 3 (depends on 1)

The conductive ink composition of claim 1, wherein the second solvent comprises at least one selected from the group consisting of ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, hexylene glycol and glycerin.

### Claim 4 (depends on 1)

The conductive ink composition of claim 1, wherein the third solvent comprises at least one selected from the group consisting of ethyl alcohol, methyl alcohol, isopropyl alcohol and acetone.

### Claim 5 (depends on 1)

The conductive ink composition of claim 1, wherein the non-aqueous solvent mixture comprises about 30% to about 60% by weight of the first solvent, about 30% to about 60% by weight of the second solvent and about 10% to about 30% by weight of the third solvent, based on a total weight of the non-aqueous solvent mixture.

### Claim 6 (depends on 1)

The conductive ink composition of claim 1, wherein an average diameter of the copper nanoparticles is about 1 nm to about 100 nm.

### Claim 7 (depends on 1)

The conductive ink composition of claim 1, wherein the copper nanoparticle comprises a skin layer including a capping polymer.

### Claim 8 (depends on 1)

The conductive ink composition of claim 1, wherein the viscosity of the conductive ink composition is about 0.5 mPa·s to about 40 mPa·s at about 25° C., and the surface tension of the conductive ink composition is about 20 mN/m to about 70 mN/m at about 25° C.