# US 7,608,173 B2 · Biased retaining ring > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,608,173 B2 - Document ID: US7608173B2 - Status: Granted - Kind: B2 - Application number: 11/003,083 - Filed: 2004-12-02 - Published: 2006-06-29 - Granted: 2009-10-27 - Earliest claimed: 2004-12-02 - Assignees: Applied Materials, Inc. - Inventors: Antoine P. Manens; Feng Q Liu; Paul D. Butterfield; Alain Duboust; Rashid Mavliev - Web page: https://patentgrep.com/patent/US7608173B2 ## CPC - B24B 37/32: Retaining rings - C25F 3/02: Etching - C25F 7/00: Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - C25F: PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR ## Abstract A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished. ## Claims ### Claim 1 A system for electrochemical mechanical processing, comprising: a polishing pad support; a carrier head, configured to contact the polishing pad support, the carrier head comprising: a base; and a retaining ring attached to the base, wherein the retaining ring comprises: a conductive portion having an upper surface and a lower surface; and an insulating portion having one or more openings extending through the insulating portion and exposing the lower surface of the conductive portion, wherein an upper surface of the insulating portion contacts the lower surface of the conductive portion; and a first voltage source electrically coupled to the conductive portion of the retaining ring. ### Claim 2 (depends on 1) The system of claim 1, further comprising an anode supported by the polishing pad support. ### Claim 3 (depends on 2) The system of claim 2, wherein the anode includes a conductive layer of a polishing pad assembly. ### Claim 4 (depends on 3) The system of claim 3, wherein the anode is electrically coupled to a second voltage source. ### Claim 5 (depends on 3) The system of claim 3, wherein the insulating portion is dimensioned such that the conductive portion does not contact the polishing pad assembly when the insulating portion contacts the polishing pad assembly. ### Claim 6 (depends on 5) The system of claim 5, wherein the insulating portion is dimensioned such that the conductive portion does not contact the polishing pad assembly when the carrier head presses the retaining ring against the polishing pad assembly. ### Claim 7 (depends on 1) The system of claim 1, further comprising a polishing pad assembly supported by the polishing pad support, wherein the polishing pad assembly includes a counter-electrode. ### Claim 8 (depends on 7) The system of claim 7, wherein the counter-electrode is electrically coupled to a second voltage source. ### Claim 9 (depends on 1) The system of claim 1, further comprising a controller, wherein the controller is capable of controlling the first voltage source. ### Claim 10 (depends on 1) The system of claim 1, further comprising a current monitor, wherein the current monitor is configured to determine a current from the retaining ring. ### Claim 11 (depends on 1) The system of claim 1, wherein the retaining ring further comprises an upper portion, wherein the upper portion contacts the conductive portion and the upper portion is configured to electrically connect the conductive portion to the voltage source. ### Claim 12 (depends on 1) The system of claim 1, wherein the openings of the insulating portion allow a portion of the lower surface to be exposed to the environment. ### Claim 13 (depends on 1) The system of claim 1, wherein the conductive portion includes one or more recesses. ### Claim 14 (depends on 13) The system of claim 13, wherein at least one of the recesses is in fluid communication with at least one of the openings in the insulating portion. ### Claim 15 (depends on 1) The system of claim 1, wherein the openings in the insulating portion are sufficiently small to prevent contact between the conductive portion and a conductive element of a polishing pad assembly when the insulating portion is in contact with the polishing pad assembly. ### Claim 16 (depends on 1) The system of claim 1, wherein the openings in the insulating portion include one or more holes. ### Claim 17 (depends on 1) The system of claim 1, wherein the openings of the insulating portion include one or more grooves. ### Claim 18 (depends on 1) The system of claim 1, wherein the conductive portion is substantially annular. ### Claim 19 (depends on 1) The system of claim 1, wherein the conductive portion is electrically coupled to an external roller. ### Claim 20 (depends on 19) The system of claim 19, wherein the voltage source is configured to apply a voltage to the conductive potion between about 0V and about 1V. ### Claim 21 (depends on 1) The system of claim 1, wherein the conductive portion is in electrical contact with a spindle. ### Claim 22 (depends on 1) The system of claim 1, wherein the conductive portion includes copper, gold, platinum, palladium, silver, rhodium or iridium. ### Claim 23 (depends on 1, 19) A method of operating the system for electrochemical mechanical processing of claim 1, comprising: contacting an insulating portion of the conductive retaining ring of claim 19 with a surface of a polishing pad assembly that is on the polishing pad support of the system of claim 19; electrically biasing the polishing pad assembly at a first voltage; electrically biasing the conductive retaining ring at a second voltage, wherein the first voltage source of claim 1 electrically biases the retaining ring at the second voltage and the first voltage is different from the second voltage; and creating a relative motion between the substrate and the polishing pad assembly, wherein the substrate is retained by the conductive retaining ring.