# US 7,607,801 B2 · Light emitting apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,607,801 B2 - Document ID: US7607801B2 - Status: Granted - Kind: B2 - Application number: 10/521,943 - Filed: 2004-10-28 - Published: 2006-07-27 - Granted: 2009-10-27 - Earliest claimed: 2003-10-31 - Assignees: Toyoda Gosei Co., Ltd. - Inventors: Yoshinobu Suehiro; Satoshi Wada; Akihito Ota - Web page: https://patentgrep.com/patent/US7607801B2 ## CPC - F21V 29/74: with fins or blades - F21V 7/0008: {providing for indirect lighting} - F21V 7/06: with parabolic curvature - F21V 7/08: with elliptical curvature - F21V 7/24: characterised by the material - F21V 7/28: characterised by coatings - F21V 15/01: Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) - F21V 29/505: of reflectors - F21V 29/507: of means for protecting lighting devices from damage, e.g. housings - F21V 29/89: Metals - H10H 20/8506: {Containers} - H10H 20/8582: {characterised by their shape} - F21K 9/68: Details of reflectors forming part of the light source - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/856: Reflecting means - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A reflection-type light emitting apparatus has an excellent heat radiation property and allows the use of a high-power light emitting element, the minimization of a reduction in radiation efficiency of reflected light, and the focused radiation of high-output light at high efficiency. The apparatus has: a case 10 of metallic material and with an excellent heat radiation property; a reflection mirror section 11 formed fitted to the lower portion of case 10; a transparent plate 12 to cover the upper surface of case 10; heat radiation plates 13, 14 of metallic material with excellent heat conductivity and inserted inside the case 10; an LED element 2 mounted on the heat radiation plate 13; lead sections 15A, 15B fixed through an insulating layer 15a to the heat radiation plate 13 to serve as a power supply member to supply power to the LED element 2; and a spacer 16 of an insulating material to insulate the lead sections 15A, 15B from the case 10. ## Claims ### Claim 1 A light emitting apparatus, comprising: a solid-state light emitting element; a power supply member that supplies power to the solid-state light emitting element; a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element; an insulating layer disposed between the power supply member and the heat radiation member; and a case in which the reflection section and the heat radiation member are placed and which externally radiates heat to be transferred from the heat radiation member, wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and wherein the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus, the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member, the solid-state light emitting element is mounted on the end face of the planar member, and the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface. ### Claim 2 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element is packaged such that the solid-state light emitting element is sealed with a light transmitting material. ### Claim 3 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element is flip-chip mounted on an inorganic material board on which a conductive pattern is formed to supply power to the solid-state light emitting element, and the solid-state light emitting element is sealed with an inorganic seal material that has a thermal expansion coefficient nearly equal to that of the inorganic material board. ### Claim 4 (depends on 3) The light emitting apparatus according to claim 3, wherein: the inorganic seal material comprises glass. ### Claim 5 (depends on 3) The light emitting apparatus according to claim 3, wherein: the inorganic material board seals the solid state light emitting element while bonding in chemical reaction to the inorganic seal material. ### Claim 6 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element is sealed with the inorganic seal material with a refractive index of 1.55 or more. ### Claim 7 (depends on 1) The light emitting apparatus according claim 1, wherein: the heat radiation member comprises a heat radiation plate that comprises a high reflectivity surface to reflect the light. ### Claim 8 (depends on 1) The light emitting apparatus according to claim 1, wherein: the heat radiation member comprises: a heat radiation support that comprises a high thermal conductivity material and transfers to the heat radiation member heat generated from the solid-state light emitting element, and a heat radiation plate that transfers the heat through the heat radiation support. ### Claim 9 A light emitting apparatus, comprising: a solid-state light emitting element; a power supply member that supplies power to the solid-state light emitting element; a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element; a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element; an insulating layer disposed between the power supply member and the heat radiation member; and a case in which the reflection section and the heat radiation member are placed and which externally radiates heat to be transferred from the heat radiation member, wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and wherein the power supply member is formed with a width in the back direction of the solid-state light emitting element, the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus, the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member, the solid-state light emitting element is mounted on the end face of the planar member, and the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface. ### Claim 10 (depends on 1) The light emitting apparatus according to claim 1, wherein: the power supply member comprises a metallic thin film and is disposed with a width in the back direction of the solid-state light emitting element and is integrated with the heat radiation member while being insulated from the heat radiation member. ### Claim 11 (depends on 10) The light emitting apparatus according to claim 10, wherein: the power supply member comprises a metallic thin film and is sandwiched through an insulator between a plurality of heat radiation plates to compose the heat radiation member. ### Claim 12 (depends on 1) The light emitting apparatus according to claim 1, wherein: a spectrum light with plurality of region wavelengths is radiated from the solid-state light emitting element or from the periphery of the solid-state light emitting element. ### Claim 13 (depends on 12) The light emitting apparatus according to claim 12, wherein: a phosphor is disposed on the periphery of the solid-state light emitting element. ### Claim 14 (depends on 1) The light emitting apparatus according to claim 1, wherein: the heat radiation member has the heat radiation width that is three times or more its thickness. ### Claim 15 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element has a width that is within five times that of the solid-state light emitting element. ### Claim 16 (depends on 1) The light emitting apparatus according to claim 1, wherein: the heat radiation member comprises a shape that protrudes toward a bottom of the reflection surface. ### Claim 17 (depends on 1) The light emitting apparatus according to claim 1, wherein: the reflection surface opposite to the solid-state light emitting element comprises a solid angle of 2π it to 3.4π strad. ### Claim 18 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element comprises a light source with a turn-on power of 1 W or more. ### Claim 19 (depends on 1) The light emitting apparatus according to claim 1, wherein: the reflection section comprises a resin material. ### Claim 20 (depends on 1) The light emitting apparatus according to claim 1, wherein: the solid-state light emitting element comprises one of a plurality of solid-state light emitting elements. ### Claim 21 (depends on 1) The light emitting apparatus according to claim 1, wherein the light emitting apparatus further comprises: a plurality of solid-state light emitting elements and a plurality of heat radiation members, the heat radiation members corresponding to the plurality of solid-state light emitting elements. ### Claim 22 (depends on 1) The light emitting apparatus according to claim 1, wherein: the plurality of solid-state light emitting elements generate a plurality of emission colors. ### Claim 23 (depends on 22) The light emitting apparatus according to claim 22, wherein: the plurality of solid-state light emitting elements generate emission colors of R, G and B. ### Claim 24 A light emitting apparatus, comprising: a solid-state light emitting element; a power supply member that supplies power to the solid-state light emitting element a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element; and a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element; and a case in which the reflection section and the heat radiation member are placed and which external radiates heat to be transferred from the heat radiation member, wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and wherein the heat radiation member is separated from the power supply member, the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus, the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member, the solid-state light emitting element is mounted on the end face of the planar member, and the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface. ### Claim 25 (depends on 1) The light emitting apparatus according to claim 1, wherein the power supply member is insulated from the heat radiation member by the insulation layer. ### Claim 26 (depends on 1) The light emitting apparatus according to claim 1, wherein said heat radiation member further comprises a second planar member disposed perpendicular to and intersecting said planar member. ### Claim 27 (depends on 1) The light emitting apparatus according to claim 1, wherein said planar member comprises a front surface, a rear surface, and said end face, a surface area of said end face is smaller than a surface area of said front surface and the surface area of said end face is smaller than a surface area of said rear surface. ### Claim 28 (depends on 1) The light emitting apparatus according to claim 1, wherein said planar member has a width and thickness, the thickness corresponding to said end face, and wherein the width of the planar member is larger than a thickness of the end face. ### Claim 29 (depends on 1) The light emitting apparatus according to claim 1, wherein the power supply member comprises a lead and the planar member is disposed parallel to a longitudinal direction of the lead.