Semiconductor structure with RF element

A structure comprising,

• a semiconductor chip including a plurality of conductive layers and dielectric layer and a passivation layer being a top most layer of the semiconductor chip, the semiconductor chip comprising:
• a primary element for performing a primary function, said primary element including a plurality of chip pads and occupying a primary region of the semiconductor chip;
• a secondary element attached to a top surface of the semiconductor chip for performing an RF communication function, the secondary element having a secondary core and occupying a secondary region of the semiconductor chip where the secondary region is smaller than the primary region;
• a chip carrier for carrying said semiconductor chip, said carrier including a plurality of carrier pads for electrical connection to said chip pads;
• and
• an antenna formed on top of the passivation layer of the semiconductor layer and electrically connected to said secondary core.

A structure comprising,

• a semiconductor chip comprising:
• a primary element for performing a primary function, said primary element including a plurality of chip pads and occupying a primary region of the semiconductor chip;
• a secondary element attached to a top surface of the semiconductor chip for performing an RF communication function, the secondary element having a secondary core and occupying a secondary region of the semiconductor chip where the secondary region is smaller than the primary region;
• a chip carrier for carrying said semiconductor chip, said carrier comprising a plurality of carrier pads for electrical connection to said chip pads and an encapsulating material;
• and
• an antenna formed on the surface of said encapsulating material of the chip carrier and electrically connected to said secondary core.