# US 7,607,559 B2 · Conductive ball arraying apparatus

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- Number: US 7,607,559 B2
- Document ID: US7607559B2
- Status: Granted
- Kind: B2
- Application number: 11/987,804
- Filed: 2007-12-04
- Published: 2008-12-11
- Granted: 2009-10-27
- Earliest claimed: 2007-06-06
- Assignees: Shibuya Kogyo Co., Ltd.
- Inventors: Yoshihisa Kajii
- Web page: https://patentgrep.com/patent/US7607559B2

## CPC

- H05K 3/3478: Application of solder preforms; Transferring prefabricated solder patterns
- H10W 72/0112: {Apparatus for manufacturing bump connectors}
- H05K 2203/0292: Using vibration, e.g. during soldering or screen printing
- H05K 2203/041: Solder preforms in the shape of solder balls
- H05K 2203/0557: Non-printed masks
- H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping}
- H10W 72/01271: {Cleaning, e.g. oxide removal or de-smearing}
- H10W 72/072: {of bump connectors}
- H10W 72/251: {Materials}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig, floating means that floats the ball cup from the arraying jig, and vibrating means that vibrates the ball cup. The moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup.

## Claims

### Claim 1

A conductive ball arraying apparatus comprising:
an arraying jig including conductive ball insertion parts in a predetermined array pattern;
a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig;
moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig;
floating means that floats the ball cup from the arraying jig; and
vibrating means that vibrates the ball cup,
wherein the moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup; and
the floating means ejects air to the top surface of the arraying jig from the bottom surface of the ball cup.

### Claim 2 (depends on 1)

The conductive ball arraying apparatus according to claim 1, wherein the vibrating means includes a vibrator attached to the ball cup.

### Claim 3

A conductive ball arraying apparatus comprising:
an arraying jig including conductive ball insertion parts in a predetermined array pattern;
a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig;
moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig; and
an air ejecting hole that ejects air from the bottom surface of the ball cup to the top surface of the arraying jig is formed,
wherein the moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup by ejecting the air from the air ejection hole.

### Claim 4

A conductive ball arraying apparatus comprising:
an arraying jig including conductive ball insertion parts in a predetermined array pattern;
a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig;
moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig;
a gas ejection part formed in the bottom surface of the ball cup,
wherein the moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig by ejecting gas from the gas ejection part.

### Claim 5 (depends on 4)

The conductive ball arraying apparatus according to claim 4,
wherein the moving means includes:
a cup holder that gives a moving force to the floated ball cup;
driving means that moves the cup holder; and
guide means that guides the movement of the cup holder, and
wherein the ball cup is movably held by the cup holder.

### Claim 6 (depends on 5)

The conductive balls arraying apparatus according to claim 5, further comprising:
a detector that detects a difference in relative position of the ball cup from the cup holder by the use of a load during the relative movement of the ball cup along the top surface of the arraying jig.

### Claim 7 (depends on 4)

The conductive ball arraying apparatus according to claim 4, wherein the floating gap of the ball cup from the arraying jig is adjusted on the basis of an amount of ejected gas.

### Claim 8 (depends on 4)

The conductive ball arraying apparatus according to claim 4, wherein the moving means moves the ball cup relatively along the top surface of the arraying jig such that the gas ejection part passes through an area other than the insertion portion of the arraying jig.