# US 7,607,228 B2 · Method of manufacturing liquid ejection head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,607,228 B2 - Document ID: US7607228B2 - Status: Granted - Kind: B2 - Application number: 11/362,946 - Filed: 2006-02-28 - Published: 2006-09-07 - Granted: 2009-10-27 - Earliest claimed: 2005-03-01 - Assignees: FUJIFILM Corporation - Inventors: Tsuyoshi Mita - Web page: https://patentgrep.com/patent/US7607228B2 ## CPC - B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm} - B41J 2/1637: {molding} - B41J 2002/14459: {Matrix arrangement of the pressure chambers} - Y10T 29/42: Piezoelectric device making - Y10T 29/49126: Assembling bases - Y10T 29/49128: Assembling formed circuit to base - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49401: Fluid pattern dispersing device making, e.g., ink jet - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The method manufactures a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers. The method comprises the steps of: filling piezoelectric material into a plurality of recess sections of a molding substrate formed with the plurality of recess sections so as to correspond to the pressure chambers; then performing a lamination step of arranging a first green sheet that is to form the diaphragm onto the molding substrate in such a manner that the first green sheet covers the recess sections filled with the piezoelectric material; then performing a first heating step of heating the piezoelectric material filled in the recess sections; and then separating the piezoelectric material from the molding substrate. ## Claims ### Claim 1 A method of manufacturing a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers, the method comprising the steps of: filling piezoelectric material into a plurality of recess sections of a molding substrate formed with the plurality of recess sections so as to correspond to the pressure chambers; then performing a lamination step of arranging a first green sheet that is to form the diaphragm onto the molding substrate in such a manner that the first green sheet covers the recess sections filled with the piezoelectric material; then forming piezoelectric bodies on an opposite side of the diaphragm from the plurality of pressure chambers; then performing a first heating step of heating the piezoelectric material filled in the recess sections; and then separating the piezoelectric material from the molding substrate. ### Claim 2 (depends on 1) The method as defined in claim 1, wherein: the first green sheet is provided with a first electrode formed on a surface thereof; the first green sheet is arranged on the molding substrate in such a manner that the surface of the first green sheet on which the first electrode is formed is adjacent to the molding substrate in the lamination step, and the lamination step further comprises the step of arranging on the first green sheet a second green sheet to form a flow channel plate constituting walls of the pressure chambers; and the method further comprises, after the separating step, the step of performing a second heating step of heating at least the piezoelectric material, the first green sheet and the second green sheet, at a temperature higher than that of the first heating step. ### Claim 3 (depends on 1) The method as defined in claim 1, further comprising, before the piezoelectric material filling step, the step of filling a binder resin into the recess sections. ### Claim 4 (depends on 1) The method as defined in claim 1, further comprising, before the piezoelectric material filling step, the step of filling second electrodes into the recess sections. ### Claim 5 (depends on 1) The method as defined in claim 1, further comprising, before the piezoelectric material filling step, the step of filling a binder resin into the recess sections and then filling second electrodes into the recess sections. ### Claim 6 (depends on 1) The method as defined in claim 1, wherein the recess sections are provided with vents. ### Claim 7 (depends on 1) The method as defined in claim 1, wherein the recess sections have uneven bottom faces. ### Claim 8 (depends on 1) The method as defined in claim 1, wherein the piezoelectric material filled in the recess sections forms the piezoelectric bodies. ### Claim 9 (depends on 1) The method as defined in claim 1, wherein, after the first heating step is performed, the piezoelectric material is separated from the molding substrate. ### Claim 10 A method of manufacturing a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers, the method comprising: a filling step of filling piezoelectric material into a plurality of recess sections of a molding substrate formed with the plurality of recess sections so as to correspond to the pressure chambers; a lamination step of arranging a first green sheet that is to form the diaphragm onto the molding substrate in such a manner that the first green sheet covers the recess sections filled with the piezoelectric material; a step of forming piezoelectric bodies on an opposite side of the diaphragm from the plurality of pressure chambers; a first heating step of heating the piezoelectric material filled in the recess sections in such a manner that the piezoelectric material contracts to form voids in the recess sections, after the lamination step is performed; and a separation step of separating the piezoelectric material from the molding substrate after the first heating step is performed.