# US 7,607,222 B2 · Method of manufacturing an electronic component package

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- Number: US 7,607,222 B2
- Document ID: US7607222B2
- Status: Granted
- Kind: B2
- Application number: 11/708,567
- Filed: 2007-02-21
- Published: 2007-12-06
- Granted: 2009-10-27
- Earliest claimed: 2006-06-02
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Myung-Sam Kang
- Web page: https://patentgrep.com/patent/US7607222B2

## CPC

- H10W 74/129: {forming a chip-scale package [CSP]}
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- H05K 3/20: by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/0394: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
- H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component
- H05K 2203/0361: Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/68: Shapes or dispositions thereof
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49126: Assembling bases
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49144: by metal fusion
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board and forming a circuit pattern, which includes a bonding pad and a solder ball pad, on the surface of the insulation layer; mounting an electronic component on the surface of the insulation layer and electrically connecting the electronic component and the bonding pad; and removing the first carrier board and the protrusion part, allows the mounting of the electronic component with just a single circuit pattern layer.

## Claims

### Claim 1

A method of manufacturing an electronic component package, the method comprising:
forming a protrusion part on a first carrier board;
stacking an insulation layer on the first carrier board and forming bonding pad and a solder ball pad on the surface of the insulation layer such that protrusion part is formed in position corresponding with the solder ball;
mounting an electronic component on the surface of the insulation layer such that the electronic component is electronically connected with the bonding pad;
removing the first carrier board and the protrusion part; and
processing a lower surface of the insulation layer such that the solder ball pad is exposed.

### Claim 2 (depends on 1)

The method of claim 1, wherein the electronic component is mounted on the surface of the insulation layer by a flip-chip method.

### Claim 3 (depends on 1)

The method of claim 1, wherein the operation of forming a protrusion part comprises:
forming a seed layer on the first carrier board;
stacking a dry film on the seed layer; and
removing a portion of the dry film to form the protrusion part.

### Claim 4 (depends on 3)

The method of claim 3, wherein
the operation of forming a protrusion part comprises attaching two of the first carrier boards such that the first carrier boards face opposite directions, and
the operation of removing a portion of the dry film comprises forming the protrusion part on each of the two first carrier boards.

### Claim 5 (depends on 1)

The method of claim 1, wherein the operation of stacking an insulation layer and forming a bonding pad and a solder ball pad comprises:
forming a seed layer on a second carrier board;
forming the bonding pad and the solder ball pad on the seed layer;
stacking the second carrier board on the insulation layer such that the bonding pad and the solder pad are embedded inside the insulation layer; removing the second carrier board; and removing the seed layer.

### Claim 6 (depends on 5)

The method of claim 5, further comprising:
stacking a dry film on the seed layer and removing a portion of the dry film and the seed layer such that an upper surface of the seed layer on the side of the bonding pad is exposed; and
surface-treating the bonding pad by supplying a voltage to the remaining seed layer,
between the operation of removing the second carrier board and the operation of removing the seed layer.