# US 7,607,221 B2 · Method of making an electronic device housing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,607,221 B2 - Document ID: US7607221B2 - Status: Granted - Kind: B2 - Application number: 10/982,700 - Filed: 2004-11-04 - Published: 2006-05-04 - Granted: 2009-10-27 - Earliest claimed: 2004-11-04 - Assignees: Piranha Plastics, LLC - Inventors: Charles A. Centofante; Brian Boothman - Web page: https://patentgrep.com/patent/US7607221B2 ## CPC - H05K 5/026: {having standardized interfaces (flash memory cards G06K19/077)} - B29C 45/006: {Joining parts moulded in separate cavities} - B29C 45/1671: {with an insert} - B29C 45/14647: {Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards} - B29C 2045/1673: {injecting the first layer, then feeding the insert, then injecting the second layer} - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49126: Assembling bases - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49144: by metal fusion - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base, over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device, and over-molding a movable component to a portion of the housing. In another implementation a method for housing an electronic device includes positioning a housing for an electrical device within a first mold cavity of an assembly mold, the housing including a base and a lid, molding a movable component in a second mold cavity of the assembly mold, and attaching the movable component to the housing while both the movable component and the housing are within the assembly mold. ## Claims ### Claim 1 A method of housing an electronic device, comprising: positioning an electronic device on a base; over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device; and over-molding a movable component to engage a portion of the housing such that the movable component is slidably attached to the portion of the housing. ### Claim 2 (depends on 1) The method of claim 1, wherein the electronic device is operable to store data and the movable component is configured to switch between a first position in which data can be written to the electronic device and a second position in which data cannot be written to the electronic device. ### Claim 3 (depends on 1) The method of claim 1, wherein the movable component is molded to a rail on a side portion of the housing. ### Claim 4 (depends on 1) The method of claim 1, wherein the movable component is operable to change an operation of the electronic device. ### Claim 5 (depends on 1) The method of claim 1, wherein the movable component comprises a dissimilar material from a material of the housing. ### Claim 6 (depends on 1) The method of claim 1, wherein the movable component is a thermoplastic material. ### Claim 7 (depends on 6) The method of claim 6, wherein the thermoplastic material has a lower melting point than a melting point of the base and the lid such that the movable component does not bond to the housing. ### Claim 8 (depends on 1) The method of claim 1, wherein the electronic device is a thin walled semiconductor device. ### Claim 9 (depends on 1) The method of claim 1, wherein the electronic device is a printed circuit board. ### Claim 10 (depends on 9) The method of claim 9, wherein the printed circuit board is a flash memory module. ### Claim 11 (depends on 1) The method of claim 1, further comprising: adhering the electronic device to the base prior to over-molding the lid. ### Claim 12 (depends on 1) The method of claim 1, wherein positioning an electronic device on a base comprises positioning the electronic device within a recess formed in the base. ### Claim 13 (depends on 1) The method of claim 1, wherein the base includes one or more raised members and the electronic device includes one or more corresponding recesses, and wherein positioning the electronic device on the base comprises engaging the one or more raised members within the one or more recesses. ### Claim 14 (depends on 1) The method of claim 1, wherein over-molding a lid comprises including an opening in the lid to provide access to an interface on the electronic device. ### Claim 15 (depends on 1) The method of claim 1, wherein the base includes an opening to provide access to an interface on the electronic device. ### Claim 16 (depends on 15) The method of claim 15, wherein over-molding a lid comprises including an opening to provide a second access to an interface on the electronic device. ### Claim 17 (depends on 1) The method of claim 1, wherein the base is formed from a thermoplastic material. ### Claim 18 (depends on 1) The method of claim 1, wherein the lid is formed from a thermoplastic material. ### Claim 19 (depends on 18) The method of claim 18, wherein the thermoplastic material is acrylonitrile butadiene styrene (ABS). ### Claim 20 A method of housing an electronic device, comprising: molding a base; positioning an electronic device on the base; over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device; and over-molding a movable component to engage a portion of the housing such that the movable component is slidably attached to a portion of the housing. ### Claim 21 A method of housing an electronic device, comprising: receiving a housing for an electronic device comprising a base and a lid; and over-molding a movable component to engage a portion of the housing such that the movable component is slidably attached to the portion of the housing. ### Claim 22 A method of assembling a housing for an electronic device, comprising: positioning an electronic device housed within a housing in a first mold cavity of an assembly mold; molding a movable component in a second mold cavity of the assembly mold; and attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing. ### Claim 23 (depends on 22) The method of claim 22, wherein the electronic device is operable to store data and the movable component is configured to switch between a first position in which data can be written to the electronic device and a second position in which data cannot be written to the electronic device. ### Claim 24 (depends on 22) The method of claim 22, wherein the movable component is attached to a rail on a side portion of the housing. ### Claim 25 (depends on 22) The method of claim 22, wherein the movable component is operable to change an operation of the electronic device. ### Claim 26 (depends on 22) The method of claim 22, wherein the movable component comprises a dissimilar material from a material of the base and the lid. ### Claim 27 (depends on 22) The method of claim 22, wherein the movable component is a thermoplastic material. ### Claim 28 (depends on 22) The method of claim 22, wherein attaching the movable component to the housing further comprises moving one or more movable blocks within the assembly mold to advance the movable component to the housing. ### Claim 29 A method for housing an electronic device, comprising: positioning a base within a first mold cavity of an assembly mold; positioning an electronic device on the base; over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device; molding a movable component in a second mold cavity of the assembly mold; and attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing. ### Claim 30 (depends on 29) The method of claim 29, wherein the electronic device is operable to store data and the movable component is configured to switch between a first position in which data can be written to the electronic device and a second position in which data cannot be written to the electronic device. ### Claim 31 A method for housing an electronic device, comprising: molding a base within a first mold cavity of an assembly mold; positioning an electronic device on the base; over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device; molding a movable component in a second mold cavity of the assembly mold; and attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing. ### Claim 32 (depends on 31) The method of claim 31, wherein the electronic device is operable to store data and the movable component is configured to switch between a first position in which data can be written to the electronic device and a second position in which data cannot be written to the electronic device. ### Claim 33 (depends on 31) The method of claim 31, wherein attaching the movable component to the housing further comprises moving one or more movable blocks within the assembly mold to advance the movable component to the housing.