Bidirectional transceiver assembly for POF application
AssigneeMassachusetts Institute of Technology
InventorsDong Pan, Jurgen Michel, Edward H. Sargent, Wojciech P. Giziewicz, Lionel C. Kimerling
Life of this patent
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Abstract
A bidirectional transceiver assembly includes a VCSEL structure that emits light at a defined wavelength on a substrate structure. A photodetector receives the light. A hole structure is formed on the substrate structure to allow the light from the VCSEL structure to be emitted so as to form an optical path.
Claims31
A light emitting and receiving device comprising:
- a substrate;
- a driver element provided on the substrate that receives a voltage signal and produces an electrical signal;
- a light emitting element provided on the substrate, said light emitting element receives said electrical signal to produce emitted light;
- and
- a photodetector provided on the substrate, said photodetector having a light transmitting portion to cause light emitted by the light emitting element to pass therethrough, said light transmitting portion comprising a hole structure on said substrate to allow the emitted light from said light emitting and receiving device to be emitted so as to form an optical path, and a multilayer DBR that is deposited on the hole structure to form an optical waveguide so as to reduce optical crosstalk.
A light emitting and receiving device comprising:
- a substrate;
- a driver element provided on the substrate that receives a voltage signal and produces an electrical signal;
- a light emitting element provided on the substrate, said light emitting element receives said electrical signal to produce emitted light;
- a photodetector provided on the substrate, said photodetector having a light transmitting portion to cause light emitted by the light emitting element to pass theretbrough, said light transmitting portion comprising a hole structure on said substrate to allow the emitted light from said light emitting and receiving device to be emitted so as to form an optical path, and a multilayer DBR that is deposited on the hole structure to form an optical filter so as to reduce optical cross talk;
- and
- an integrated circuit that comprises all components of said light emitting device.
A method for forming a substrate, the method comprising the steps of:
- providing a substrate;
- forming a driver element provided on the substrate that receives a voltage signal and produces an electrical signal;
- forming a light emitting element on the substrate, said light emitting element receives said electrical signal to produce emitted light;
- forming a photodetector on said substrate;
- and
- forming a light transmitting portion for transmitting light from the light emitting element, said light transmitting portion comprising a hole structure on said substrate to allow the emitted light from said light emitting and receiving device to be emitted so as to form an optical path, and a multilayer DBR that is deposited on the hole structure to form an optical filter so as to reduce optical cross talk.
A bidirectional transceiver assembly:
- a driver element provided on the substrate that receives a voltage signal and produces an electrical signal;
- a VCSEL structure that emits light at a defined wavelength on a substrate structure, said VCSEL structure receives said electrical signal to produce emitted light;
- a photodetector that receives the light;
- a hole structure that is formed on said substrate structure to allow the emitted light from said VCSEL structure to be emitted so as to form an optical path;
- and
- a multilayer DBR that is deposited on the hole structure to form an optical filter so as to reduce cross talk.
A method of forming a bidirectional transceiver assembly:
- forming a driver element on the substrate that receives a voltage signal and produces an electrical signal;
- forming a VCSEL structure that emits light at a defined wavelength on a substrate structure, said VCSEL structure receives said electrical signal to produce emitted light;
- forming a photodetector that receives the light;
- forming a hole structure on said substrate structure to allow the emitted light from said VCSEL structure to be emitted so as to form an optical path;
- and
- forming a multilayer DBR that is deposited on the hole structure to form an optical filter so as to reduce crosstalk.
Dependencies are inferred from the claim text.