CT detector module construction
AssigneeGeneral Electric Company
InventorsJohn Eric Tkaczyk, Jonathan D. Short, Yanfeng Du, James Wilson Rose, Charles G. Woychik
Life of this patent
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Abstract
A detector module for a CT imaging system is provided. The detector module includes a sensor element to convert x-rays to electrical signals. The sensor element is coupled to a data acquisition system (DAS) via an interconnect system, the DAS comprised of an electronic substrate and an integrated circuit. The interconnect system couples the sensor element, electronic substrate, and integrated circuit by way of a contact pad interconnect together with a wire bond interconnect or an additional contact pad interconnect.
Claims22
A CT imaging system comprising:
- a gantry having a bore therethrough designed to receive a patient being translated through the bore;
- an x-ray source disposed in the gantry and configured to emit x-rays toward the patient;
- and
- a detector module disposed in the gantry to receive x-rays signals attenuated by the patient, wherein the detector module further comprises:
- a sensor element to convert the x-ray signals to corresponding electrical signals;
- at least one bias voltage control connected to the sensor element to provide functionality to dynamically control a sensor pixel configuration in the detector module;
- a data acquisition system (DAS) to condition the electrical signals, the DAS comprising at least one integrated circuit on an electronic substrate, the DAS further connected to the at least one bias voltage control;
- and
- an interconnect system to couple the sensor element, the at least one integrated circuit, and the electronic substrate, wherein the interconnect system includes a first contact pad interconnect and one of a wire bonds interconnect and a second contact pad interconnect.
A detector module for use in a CT imaging system, the detector module comprising:
- a direct conversion sensor configured to receive x-ray signals and convert the x-ray signals to corresponding analog signals;
- at least one bias voltage control for dynamic adjustment of an active area of a sensor element in the detector module;
- a data acquisition system (DAS) having an integrated circuit mounted to an electronic substrate, the integrated circuit configured to convert the analog signals to corresponding digital signals, the DAS further connected to the at least one bias voltage control;
- a first bond system interconnecting the direct conversion sensor to one of the integrated circuit and the electronic substrate, wherein the first bond system comprises a first bump bond array;
- and
- a second bond system interconnecting the integrated circuit to the electronic substrate, wherein the second bond system comprises one of a wire bond array and a second bump bond array.
A method of constructing a detector module comprising the steps of:
- positioning an x-ray sensor to receive x-rays from an x-ray source;
- positioning a scintillator behind the x-ray sensor as compared to the x-ray source to receive x-rays from the x-ray source;
- positioning a data acquisition system (DAS) behind the x-ray sensor as compared to the x-ray source, the DAS including an electronic substrate having at least one integrated circuit thereon;
- coupling the x-ray sensor to the electronic substrate by way of a bump bond system;
- and
- coupling the at least one integrated circuit to the electronic substrate by one of a wire bond system and a second bump bond system.
Dependencies are inferred from the claim text.