Three-dimensional programmable resistance memory device with a read/write circuit stacked under a memory cell array
AssigneeKabushiki Kaisha Toshiba
InventorHaruki Toda
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AssigneeKabushiki Kaisha Toshiba
InventorHaruki Toda
Estimating the term…
A programmable resistance memory device includes a semiconductor substrate, at least one cell array, in which memory cells are arranged and formed above the semiconductor substrate. Each of the memory cells has a stack structure of a programmable resistance element and an access element, the programmable resistance element storing a high resistance state or a low resistance state based on the polarity of voltage application in a non-volatile manner. The access element has a resistance value in an off-state in a certain voltage range that is ten time or more as high as that in a select state. A read/write circuit is formed on the semiconductor substrate and underlying the cell array for data reading and data writing in communication with the cell array.
A programmable resistance memory device comprising:
A programmable resistance memory device comprising:
A programmable resistance memory device comprising:
Dependencies are inferred from the claim text.