Compact module system and method

A circuit module comprising:

• a multilayer flex circuit have first and second sides, the first side being populated with first and second sets of integrated circuits, the second side being populated with a third set of integrated circuits disposed diametrically opposite the first set of integrated circuits;
• a rigid planar substrate, the multilayer flex circuit being folded between the first and second sets of integrated circuits and set about said rigid planar substrate so as to dispose said first and second sets of integrated circuits adjacent to and separated from each other by said rigid planar substrate with the rigid planar substrate being substantially coincident with a first medial plane, a plane separating the first and the second set of integrated circuits, and a part of the multilayer flex circuit separating the third set of integrated circuits from the first set of memory integrated circuits being substantially coincident with a second medial plane, a plane separating the first and the third set of integrated circuits, which is parallel to said first medial plane, three layers of integrated circuits therefore being exhibited which three layers are comprised from said first, second and third sets of integrated circuits to form an assembly which is electrically connected to a connector and fitted into an open-ended enclosure which is closed by said connector and the assembly being disposed in said enclosure so as to position said second set of integrated circuits and said third set of integrated circuits adjacent the enclosure.