US 7,606,047 B2 · Module with embedded electronic components

Abstract

In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.

Claims11

Dependent claims

A module with embedded electronic components comprising:

a substrate;
a plurality of electronic components each of which is mounted on the substrate and is at least one of a resistor, a capacitor, and a coil;
and
an encapsulating resin in which the electronic components are encapsulated, wherein
connection electrodes connected to the electronic components are formed on a component mounting surface of the substrate on which the electrode components are mounted,
each of the electronic components comprises two electrode portions fixed to the individual connection electrodes each by using a solder and a main body portion interposed between the two electrode portions,
when a distance between the component mounting surface and a lower surface of the main body portion is assumed to be a and a thickness of the portion of the encapsulating resin which is located above the main body portion is assumed to be b, b/a is not more than 6, and
a thickness of the portion of the encapsulating resin which is located above the component mounting surface is not less than 400 μm and not more than 600 μm.

5 more elements

Dependencies are inferred from the claim text.

Module with embedded electronic components

Life of this patent

Module with embedded electronic components

Life of this patent

Abstract

Claims11