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US 7,606,034 B2Granted
Thermally enhanced memory module
AssigneeCorsair Memory, Inc.
InventorsAndy Paul, Dan Solvin, Don Lieberman, John S. Beekley, Martin E. Mueller, Robert Pearce
Life of this patent
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Abstract
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
Claims12
A method of thermally enhancing a memory module, the memory module having a substrate, the substrate comprising a plurality of electrical planes, the method comprising:
- extending a first of the plurality of electrical planes of the substrate;
- providing a thermal connection between a top surface plane of the substrate and the first electrical plane, wherein the top surface plane of the substrate is one on which one or more memory devices of a first plurality of memory devices are mounted;
- coupling a first thermal management structure to the top surface plane of the substrate and to the thermal connection, wherein the thermal connection comprises thermal vias;
- and
- coupling a second thermal management structure to a bottom surface plane of the substrate, wherein the bottom surface plane of the substrate is one on which one or more memory devices of a second plurality of memory devices are mounted, the thermal connection connecting the bottom surface plane of the substrate to the first electrical plane, the second thermal management structure also coupled to the thermal connection.
2 more elements
A system, comprising:
- a memory module, the memory module having:
- a substrate, the substrate comprising a first extended electrical plane, and a thermal connection between a top surface plane of the substrate and the first extended electrical plane;
- one or more memory devices of a first plurality of memory devices mounted on the top surface plane of the substrate;
- a first thermal management structure, the first thermal management structure coupled to the top surface plane of the substrate, the first thermal management structure also coupled to the thermal connection, wherein the thermal connection comprises thermal vias;
- a second thermal management structure coupled to a bottom surface plane of the substrate, the second thermal management structure also coupled to the thermal connection;
- and
- one or more memory devices of a second plurality of memory devices mounted on the bottom surface plane of the substrate.
4 more elements
Dependencies are inferred from the claim text.