Apparatus and method for controlling die force in a semiconductor device testing assembly
AssigneeDelta Design, Inc.
InventorsTroy Taylor, Steve Wetzel
Life of this patent
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Abstract
A semiconductor device test assembly includes a heat sink having a surface configured to support a device under test, an inner bellow, an outer bellow at least partially surrounding the inner bellow, and a fluid channel within the inner bellow for providing a fluid to the heat sink. The semiconductor device test assembly can further include an air adjustment unit for adjusting an air pressure in the outer bellow, so as to adjust a contact force between the heat sink and the device under test.
Claims27
A semiconductor device test assembly, comprising:
- a heat sink having a surface configured to support a device under test and to provide heat transfer using a thermal medium;
- an inner bellow, having an inner surface and an outer surface;
- an outer bellow at least partially surrounding the inner bellow, the outer bellow having an inner surface and an outer surface;
- a control unit for detecting a contact force between the heat sink and the device under test and adjusting the contact force between the heat sink and the device under test;
- and
- a thermal medium path,
- wherein both the inlet and exit of the thermal medium path are defined by one of the inner bellow or the outer surface of the inner bellow and the inner surface of the outer bellow and provide heat transfer through the thermal medium.
A semiconductor device test assembly, comprising:
- a heat sink having a surface configured to support a device under test;
- an inner bellow;
- an outer bellow at least partially surrounding the inner bellow;
- a fluid channel within the inner bellow for providing a fluid to the heat sink;
- a control unit for adjusting a contact force between the heat sink and the device under test;
- and
- an air adjustment unit for adjusting an air pressure in the outer bellow;
- wherein the air adjustment unit is configured to adjust the air pressure in the outer bellow in accordance with a control signal from the control unit.
In a semiconductor device test assembly comprising a heat sink having a surface configured to support a device under test, an inner bellow, an outer bellow at least partially surrounding the inner bellow, and a fluid channel within the inner bellow for providing a fluid to the heat sink, a method for controlling a contact force between the heat sink and the device under test, the method comprising:
- receiving an indication of a desired contact force between the heat sink and the device under test;
- detecting an actual contact force between the heat sink and the device under test;
- increasing an air pressure in the outer bellow if the desired contact force is greater than the actual contact force;
- and
- decreasing the air pressure in the outer bellow if the desired contact force is less than the actual contact force.
Dependencies are inferred from the claim text.