Hermetically sealed structure, piezoelectric device and improvement of method for manufacturing the same
AssigneeEpson Toyocom Corporation
InventorTakuo Kuwahara
Life of this patent
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Abstract
A hermetically sealed structure in which a base substrate 31 and a lid 33 are hermetically sealed, the base substrate serving as a part of a containing body for uniformly forming or bonding an electronic part, the lid being a lid body to be hermetically bonded to the base substrate, is structured as follows: the lid is made from a material, through which light passes; as a metal layer 25 of at least a sealing portion of the lid a platable layer 22 for performing plating and a bonding layer 24 made from gold, the bonding layer being formed closer to the front side than the platable layer are formed; and the lid is structured so as to be bonded to the base substrate 31 by an Au—Ge alloy.
Claims8
A hermetically sealed structure comprising:
- a base substrate;
- a lid hermetically bonded to the base substrate by an Au—Ge alloy, the lid being made from a material through which light passes;
- a first metal layer provided on a surface of the lid bonded to the base substrate, the first metal layer including:
- a first foundation layer made from Cr formed on the surface of the lid;
- a first platable layer made from either Au or Al alloy formed on the first foundation layer;
- a first bonding layer made from Au, the first bonding layer being formed closer to the Au—Ge alloy than the first platable layer;
- and
- a first barrier layer made from Ni formed between the first platable layer and the first bonding layer;
- a second metal layer provided on a surface of the base substrate bonded to the lid, the second metal layer including:
- a second foundation layer made from Cr formed on the surface of the base substrate;
- a second platable layer made from either Au or Al alloy formed on the second foundation layer;
- a second bonding layer made from Au, the second bonding layer being formed closer to the Au—Ge alloy than the second platable layer;
- a second barrier layer made from Ni formed between the second platable layer and the second bonding layer;
- wherein the Au—Ge alloy is sandwiched between the first metal layer and the second metal layer;
- and
- the base substrate serves as a part of a containing body for a piezoelectric device.
A piezoelectric device comprising:
- a base substrate;
- a first Au—Ge alloy formed on the base substrate;
- a framed resonator element fixed to the base substrate by the first Au—Ge alloy;
- a second Au—Ge alloy formed on the framed resonator element;
- a lid fixed to the framed resonator element by the second Au—Ge alloy, the lid being formed from a material through which light passes;
- and
- first and second pairs of metal layers that sandwich the first and second Au—Ge alloys, respectively, each of the metal layers including:
- a foundation layer made from Cr;
- a platable layer including either Au or Al alloy formed on the first foundation layer;
- a bonding layer made from Au, the bonding layer being formed closer to the respective Au—Ge alloy than the platable layer;
- and
- a barrier layer made from Ni formed between the platable layer and the bonding layer.
A piezoelectric device comprising:
- a base substrate;
- a first Au—Ge alloy formed on the base substrate;
- a piezoelectric resonator element fixed to the base substrate by the first Au—Ge alloy;
- a second Au—Ge alloy formed on the resonator element;
- a lid fixed to the resonator element by the second Au—Ge alloy, the lid being formed from a material through which light passes;
- and
- first and second pairs of metal layers that sandwich the first and second Au—Ge alloys, respectively, each of the metal layers including:
- a foundation layer made from Cr;
- a platable layer including either Au or Al alloy formed on the first foundation layer;
- a bonding layer made from Au, the bonding layer being formed closer to the respective Au—Ge alloy than the platable layer;
- and
- a barrier layer made from Ni formed between the platable layer and the bonding layer,
- wherein the base substrate has a thorough hole sealed by a filler material.
Dependencies are inferred from the claim text.