Semiconductor package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKyung-Man Kim, Sun-Mo Yang, Chang-Hoon Han
Life of this patent
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Abstract
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the semiconductor package. The semiconductor package includes a substrate including a finger, at least one semiconductor chip stacked on the substrate, the semiconductor chip including a chip pad, and a wire which electrically connects the finger with the chip pad, wherein one end of the wire bonds with an upper surface and lateral surfaces of the finger.
Claims14
A semiconductor package comprising:
- a substrate including a finger;
- at least one semiconductor chip stacked on the substrate, the at least one semiconductor chip including a chip pad;
- and
- a wire that electrically connects the finger with the chip pad,
- wherein a protrusion at one end of the wire is bonded with an upper surface and lateral surfaces of the finger and wherein a center of the wire and a portion of the protrusion bonded to the lateral surfaces of the finger comprise the same material.
A semiconductor package comprising:
- a substrate including a finger;
- at least one semiconductor chip stacked on the substrate, the at least one semiconductor chip including a chip pad;
- and
- a wire that electrically connects the finger with the chip pad,
- wherein one end of the wire is bonded with an upper surface and lateral surfaces of the finger,
- wherein a protrusion is formed on the one end of the wire in order to bond with the upper surface and the lateral surfaces of the finger, and when the substrate is viewed along its normal direction, the maximum width of the upper surface of the finger is less than the diameter of the protrusion,
- wherein the shape of the upper surface of the finger is a polygon, and
- wherein the polygon is a quadrangle whose sides are of substantially the same length.
A semiconductor package comprising:
- a substrate including a finger;
- at least one semiconductor chip stacked on the substrate, the at least one semiconductor chip including a chip pad;
- and
- a wire that electrically connects the finger with the chip pad,
- wherein one end of the wire is bonded with an upper surface and lateral surfaces of the finger,
- wherein a protrusion is formed on the one end of the wire in order to bond with the upper surface and the lateral surfaces of the finger, and when the substrate is viewed along its normal direction, the maximum width of the upper surface of the finger is less than the diameter of the protrusion,
- wherein the upper surface of the finger is within a lower surface of the finger when the substrate is viewed along its normal direction, and
- wherein the wire is formed as a plurality of wires that respectively correspond to a plurality of fingers such that boundaries between the lateral surfaces of the fingers sequentially contact each other such that the fingers are electrically connected to each other.
Dependencies are inferred from the claim text.