Stacked die semiconductor package

A stacked die semiconductor package, comprising:

• a substrate having a first surface and a second surface, the second surface being opposite to the first surface;
• a plurality of dice stacked one on top of another on said first surface of said substrate, the plurality of dice including a first die mounted on said first surface of said substrate;
• a second die having a larger footprint area than said first die;
• a top die;
• and a third die underlying said top die and having a greater footprint area than said top die;
• said first, second, and top dice being connected through wire connections to said first surface of said substrate;
• and
• a first interposer mounted on top of said first die and under said second die.

A stacked die semiconductor package, comprising:

• a substrate having a first surface and a second surface, the second surface being opposite to the first surface;
• a first die mounted on said first surface of said substrate, the first die being connected through wire connections to said first surface of said substrate;
• a first interposer mounted on top of said first die;
• a second die having a greater footprint area than said first die, said second die being mounted over said first interposer and being connected through wire connections to said first surface of said substrate;
• a third die having a smaller footprint area than the second die, being mounted over said second die, being connected through wire connections to said first surface of said substrate;
• and
• a top die having a smaller footprint area than said third die, being mounted over said third die, and being connected through wire connections to said third die.

A stacked die semiconductor package, comprising:

• a substrate having a first surface and a second surface;
• a plurality of dice stacked one on top of another on said first surface of said substrate, the plurality of dice including a bottom die that is mounted closest to said first surface, a first intermediate die mounted over said first die and having a larger footprint than said first die, and a top die having a smaller footprint than said first intermediate die, each die having a plurality of contact pads, at least some of said plurality of said dice being electrically coupled to said first surface of said substrate using at least some of said contact pads;
• and
• at least one interposer between at least some of said plurality of dice, wherein said top die is electrically directly coupled to said first intermediate die.