Semiconductor device
AssigneesSanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
InventorIsao Ochiai
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Abstract
The invention reduces outside dimensions of a semiconductor device mounted with a semiconductor die on an external connection medium and minimizes degradation of electrical characteristics of the semiconductor device. The semiconductor device of the invention having a semiconductor die and a lead frame with a plurality of lead terminals has following features. The semiconductor die has a plurality of pad electrodes formed on its front surface, at least one via hole penetrating the semiconductor die, a columnar electrode electrically connected with the pad electrode through the via hole, and a protrusion electrode electrically connected with the columnar electrode. At least one of the lead terminals of the lead frame is formed extending to a position connectable with the protrusion electrode, being connected with the protrusion electrode.
Claims5
A semiconductor device comprising:
- a die made of a semiconductor and having a via hole;
- a pad electrode disposed on a front surface of the semiconductor die;
- a lead comprising a plurality of lead terminals and not having an island portion to support the semiconductor die;
- a wiring layer disposed on a back surface of the semiconductor die and connected to the pad electrode through the via hole, the back surface facing the lead;
- and
- a protrusion electrode disposed on the back surface so as to be physically in contact with the wiring layer,
- wherein at least one of the lead terminals is in physically contact with the protrusion electrode,
- the wiring layer extends away from the protrusion electrode, and
- the lead terminal physically in contact with the protrusion electrode extends inwardly in a direction parallel to the front surface of the semiconductor die so as not to overlap the via hole.
A semiconductor device comprising:
- a die made of a semiconductor and having a via hole;
- a pad electrode disposed on a front surface of the semiconductor die;
- a lead body comprising a plurality of elongated lead terminals that converge into a center of the lead body so as to leave an empty space in the center of the lead body;
- a wiring layer disposed on a back surface of the semiconductor die and connected to the pad electrode through the via hole, the back surface facing the lead body;
- and
- a protrusion electrode disposed on the back surface so as to be in contact with the wiring layer,
- wherein at least one of the lead terminals is physically in contact with the protrusion electrode,
- the wiring layer extends away from the protrusion electrode, and
- the lead terminal physically in contact with the protrusion electrode extends toward the center of the lead body in a direction parallel to the front surface of the semiconductor die so as not to overlap the via hole.
Dependencies are inferred from the claim text.