Universal substrate for a semiconductor device having selectively activated fuses
AssigneePowertech Technology Inc.
InventorsHung-Hsin Hsu, Chi-Chung Yu
Life of this patent
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Abstract
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses are connected with the bifurcate wirings in series. By the bifurcate wirings and the fuses, each of the inner pads is electrically connected to all of the outer pads to provide optional electrical disconnections therebetween. Accordingly, the universal substrate can provide for various chips with different serial arrangements of bonding pads without replacing or manufacturing another kind of substrate.
Claims7
A universal substrate comprising:
- a plurality of inner pads and a plurality of outer pads;
- a plurality of bifurcate wirings formed on a surface of the universal substrate;
- and
- a plurality of fuses formed on the surface of the universal substrate and connected with the bifurcate wirings in series for allowing each of the inner pads to be electrically connected to all of the outer pads and providing optional electrical disconnections.
A universal substrate comprising a plurality of inner pads and a plurality of outer pads, further comprising a plurality of bifurcate wirings and a solder resist layer formed on a surface of the universal substrate, wherein the solder resist layer has a plurality of openings to expose some sections of the bifurcate wirings to form breakable fuses so that each of the inner pads is electrically connected to all of the outer pads with a possibility for optional electrical disconnections.
Dependencies are inferred from the claim text.