Method and apparatus for a power distribution system

A power distribution system, comprising:

• a package substrate including,
• a plurality of conductive layers separated by a plurality of insulating layers, each of the plurality of insulating layers having a first thickness;
• and
• a plurality of copper-clad laminate structures, each copper-clad laminate structure including first and second conductive layers having first and second perforation patterns, the first and second conductive layers being separated by an insulating layer having a second thickness;
• a die coupled to the package substrate and adapted to conduct operational power from the plurality of copper-clad laminate structures;
• and
• wherein the second thickness is less than one quarter of the first thickness.

A method of forming a power distribution system within a package substrate, the method comprising:

• developing a starting material to form power plane pairs within the package substrate, the starting material including first and second conductive layers separated by a first insulating layer;
• laminating the power plane pairs together to form a core portion of the package substrate;
• laminating build-up layers to the core portion to form build-up portions of the package substrate, the build-up portions including a plurality of conductive layers separated by a plurality of second insulating layers;
• and
• wherein a thickness of the first insulating layer is less than half of a thickness of the plurality of second insulating layers.