Method and apparatus for integrating capacitors in stacked integrated circuits
AssigneeXilinx, Inc.
InventorsArifur Rahman, Stephen M. Trimberger
Life of this patent
Estimating the term…
Abstract
Method and apparatus for integrating capacitors in stacked integrated circuits are described. One aspect of the invention relates to a semiconductor assembly having a carrier substrate, a plurality of integrated circuit dice, and at least one metal-insulator-metal (MIM) capacitor. The integrated circuit dice are vertically stacked on the carrier substrate. Each MIM capacitor is disposed between a first integrated circuit die and a second integrated circuit die of the plurality of integrated circuit dice. The at least one MIM capacitor is fabricated on at least one of a face of the first integrated circuit die and a backside of the second integrated circuit die.
Claims10
An assembly, comprising:
- a carrier substrate;
- a plurality of integrated circuit dice vertically stacked on the carrier substrate;
- and
- at least one metal-insulator-metal (MIM) capacitor disposed between a first integrated circuit die and a second integrated circuit die of the plurality of integrated circuit dice;
- wherein the MIM capacitor includes a first capacitive plate coupled to a first through die via (TDV) that extends to a contact at a surface of the first die on which the first capacitive plate is formed;
- wherein the MIM capacitor includes a second capacitive plate coupled to a second TDV that extends to a contact at a surface of the second die on which the second capacitive plate is formed;
- and
- wherein the first capacitive plate is located on the face of the first integrated circuit die and the second capacitive plate is located on the backside of the second integrated circuit die, and the respective first and second dies are electrically connected through at least one of the contacts.
Dependencies are inferred from the claim text.