Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• a plurality of stacked semiconductor chips, at least one of the semiconductor chips including a semiconductor substrate, a first insulating layer that is provided on side faces and an upper face of the semiconductor substrate, first metal layers that are provided on side faces and an upper face of the first insulating layer, and a second insulating layer that is provided on upper faces of the first metal layers and side faces of the first insulating layer and the first insulating layer has concavities formed through and on the side faces thereof, and
• second metal layers that are provided in the concavities and are connected to the first metal layers formed on the at least one of the semiconductor chips, the second metal layers being connected to the first metal layers through the concavities.