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US 7,605,453 B2Granted
Chip module and chip card
AssigneeInfineon Technologies AG
InventorsPeter Stampka, Frank Puschner, Erik Heinemann, Birgit Binder
Life of this patent
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AssigneeInfineon Technologies AG
InventorsPeter Stampka, Frank Puschner, Erik Heinemann, Birgit Binder
Estimating the term…
A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.
A bendable chip module comprising:
A chip card with two longitudinal sides and two transverse sides, the chip card being bendable such that a vertex line of a greatest curvature of the chip card is parallel to the longitudinal sides, and the chip card having a bendable chip module comprising:
A bendable chip card with two longitudinal sides and two transverse sides, the bendable chip card having an axis of symmetry, which is parallel to the longitudinal sides and comprising a bendable chip module having:
Dependencies are inferred from the claim text.