US 7,605,452 B2 · Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module

Abstract

A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.

Claims13

Dependent claims

A semiconductor device, comprising:

a silicon submount having an insulating oxide layer formed on a surface;
a semiconductor chip mounted onto the silicon submount;
and
a predetermined wiring pattern formed on the insulating oxide layer,
the wiring pattern including:
a plurality of chip connecting terminal portions connecting the semiconductor chip;
a plurality of external connecting terminal portions connecting an external unit;
and
a plurality of lead portions connecting a corresponding one of the chip connecting terminal portions and a corresponding one of the external connecting terminal portions, and
an area of the chip connecting terminal portion is larger than an area of a region where the chip connecting terminal portions and the semiconductor chip overlap with each other.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/519,144Filed 12 Sep 2006

Priority

JP 2005-2948867 Oct 2005

Published

US 2007/0080438 A112 Apr 2007

Granted

20 Oct 2009

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/611
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together
H10W 70/698
Insulating materials thereof: semiconductor materials that are electrically insulating, e.g. undoped silicon
H10W 90/00
Package configurations

Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module

Life of this patent

Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module

Life of this patent

Abstract

Claims13