Image pickup device and method of manufacturing the same

A method of manufacturing an image pickup device including:

• a sensor substrate having a plurality of image sensors arranged in an image pickup region of the sensor substrate in a form of a matrix;
• an interlayer insulating film layer formed below a bottom surface of the sensor substrate, the interlayer insulating film layer including a plurality of insulating layers and having wiring layers formed within the interlayer insulating film layer to construct an electric circuit with the image sensors;
• a support substrate attached on a bottom surface of the interlayer insulating film layer to be opposite to the sensor substrate, which support substrate includes:
• a top surface proximate the interlayer insulating film layer,
• a bottom surface opposing the top surface and distal the sensor substrate, and
• contact electrodes buried within the support substrate, extending between the top surface and the bottom surface and being electrically coupled to the wiring layers of the interlayer insulating film layer at the top surface to electrically connect the top surface to the image sensors through the wiring layers;
• and
• a lens layer formed over a top surface of the sensor substrate to be opposite to the interlayer insulating film layer, which lens layer has a plurality of microlenses formed within the lens layer, the method comprising:
• attaching the support substrate having contact electrodes buried within the support substrate on the bottom surface of the interlayer insulating film layer to be opposite to the sensor substrate;
• and
• forming the lens layer having the plurality of microlenses formed within the lens layer over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer.

An image pickup device comprising:

• a sensor substrate which has a plurality of image sensors arranged in an image pickup region on the sensor substrate, in a form of a matrix;
• an interlayer insulating film layer formed below a bottom surface of the sensor substrate, the interlayer insulating film layer including a plurality of insulating layers having wiring layers formed within the interlayer insulating film layer to construct an electric circuit, the wiring layer being electrically connected with the image sensors;
• a support substrate attached on a bottom surface of the interlayer insulating film layer, the support substrate having contact electrodes buried within the support substrate which electrodes extend between a bottom surface side and a top surface side of the support substrate and are electrically coupled to the wiring layers of the interlayer insulating film layer at the top surface side to electrically connect the top surface side to the image sensors through the wiring layers;
• a lens layer formed over a top surface of the sensor substrate to be opposite to the interlayer insulating film layer, the lens layer having a plurality of microlenses formed within the lens layer;
• and
• a light-transmitting member which includes a light-transmitting layer which covers the lens layer, and spacers which allows the light-transmitting layer to be mounted over the sensor substrate.

A method of manufacturing an image pickup device including:

• a sensor substrate having a plurality of image sensors arranged in an image pickup region of the sensor substrate in a form of a matrix;
• an interlayer insulating film layer formed below a bottom surface of the sensor substrate, the interlayer insulating film layer including a plurality of insulating layers and having wiring layers formed within the interlayer insulating film layer to construct an electric circuit for driving the image sensors, the wiring layer being electrically connected with the image sensors;
• a support substrate attached on a bottom surface of the interlayer insulating film layer, the support substrate having contact electrodes buried within the support substrate which electrodes extend between a bottom surface side and a top surface side of the support substrate and are electrically coupled to the wiring layers of the interlayer insulating film layer at the top surface side to electrically connect the top surface side to the image sensors through the wiring layers;
• a lens layer formed over a top surface of the sensor substrate to be opposite to the interlayer insulating film layer, the lens layer having a plurality of microlenses formed within the lens layer;
• and
• a light-transmitting member which includes a light-transmitting layer which covers the lens layer, and spacers which allows the light-transmitting layer to be mounted over the sensor substrate, the method comprising:
• attaching the support substrate having contact electrodes buried within the interlayer insulating film layer on the bottom surface of the interlayer insulating film layer;
• forming the lens layer having the plurality of microlenses formed within the lens layer over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer;
• and
• forming the light-transmitting layer over the lens layer by using spacers such that the light-transmitting layer and the spacers are integrally formed with each other.