Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
AssigneeOpnext Japan, Inc.
InventorsNoriko Sasada, Kazuhiko Naoe, Masataka Shirai, Hideo Arimoto, Satoshi Tada
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Abstract
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
Claims15
A chip carrier including a dielectric or semiconductor substrate, one surface of which includes a metal-coated portion and an opposite surface of which includes a high frequency transmission line and a metal-coated portion to mount an electronic device, the high frequency transmission line being disposed in a high frequency transmission section of the substrate, and the metal coated portion to mount the electronic device being disposed in a differing device-mounting section of the substrate, wherein said metal-coated portion of said one surface is connected with said metal-coated portion of said opposite surface through a metal-coated portion formed in the device-mounting section of the substrate on an outermost side surface of said substrate, which outermost side surface is closest to the electronic device.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of the substrate to mount a device and a high frequency transmission line arranged on a front surface, and a metal-coated portion formed on a rear surface of the substrate,
- wherein an electronic element is mounted at said metal-coated portion of said front surface, as the device,
- wherein a metal-coated portion is formed on a side surface of the substrate,
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate,
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by a metallic via-hole formed through the substrate, and
- wherein said via-hole is placed under said electronic element.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of a substrate to mount an optical semiconductor device and a high frequency transmission line arranged on a front surface, and a metal-coated portion on a rear surface of the substrate,
- wherein a modulator integrated semiconductor laser element is mounted at said metal-coated portion of said front surface, as the optical semiconductor device,
- wherein a metal-coated portion is formed on a side surface of the substrate,
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate,
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by a metallic via-hole formed through the substrate, and
- wherein said via-hole is placed under said modulator integrated semiconductor laser element.
Dependencies are inferred from the claim text.