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US 7,605,397 B2Granted
Capacitive bypass
AssigneeDigirad Corporation
InventorsJoel Kindem, Lars S. Carlson
Life of this patent
Estimating the term…
Abstract
An indirect connection to and across a photodiode array. The backside contact is used as one portion which connects to a capacitor. The capacitor forms a shunt across the bulk substrate, thus shunting across the series resistance of the substrate, and reducing the series resistance.
Claims13
A photodiode array, comprising:
- a semiconductor substrate including first surface, including a plurality of gates thereon, a second opposing surface, forming an optical window to receive illumination therethrough, and a capacitively coupled contact, coupled between said second surface and said first surface.
A backside illuminated photodiode, comprising:
- a semiconductor substrate having a first surface, with a plurality of photodiode elements, said first surface including a plurality of gates forming photodiodes with the substrate, and adapted to form a depletion region in the substrate therearound, a guard area, which forms a guard around said depletion region, and a moat area which allows a connection to an undepleted portion of the semiconductor substrate;
- and
- a second surface, having a illumination window, a bias connection, allowing bias connection for the photodiodes, and a capacitive connection, between said bias connection, and said moat.
Dependencies are inferred from the claim text.