Curing composition
AssigneeKaneka Corporation
InventorsKatsuyu Wakabayashi, Toshihiko Okamoto, Hiroshi Ando
Life of this patent
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Abstract
An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds, (B) a metal carboxylate and/or carboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the α or β position with respect to the silicon atom.
Claims16
A curing composition which comprises:
- (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds and being one or more polymers selected from the group consisting of a polyoxyalkylene polymer, a saturated hydrocarbon polymer and a (meth)acrylate polymer,
- (B) a tin carboxylate which is a non-organotin compound and in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom and/or a monocarboxylic acid, and
- (C) a silicon compound having a hetero atom on the carbon atom in the α or β position with respect to the silicon atom.
Dependencies are inferred from the claim text.