Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound
AssigneeSumitomo Bakelite Co., Ltd.
InventorKazuyoshi Murotani
Life of this patent
Estimating the term…
Abstract
There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.
Claims12
An epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition:
- wherein Rs, which are the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less;
- wherein Rs, which are the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less.
An epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of a benzene ring or a naphthalene ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition:
- wherein Rs, which are the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less;
- wherein Rs, which are the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less.
An epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of a naphthalene ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition:
- wherein Rs, which are the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less;
- wherein Rs, which may be the same or different, represent hydrogen or alkyl having 1 to 4 carbon atoms;
- a is an integer of 0 to 4;
- b is an integer of 0 to 4;
- c is an integer of 0 to 3;
- d is an integer of 0 to 4;
- and n is an average and 0 or a positive number of 10 or less.
Dependencies are inferred from the claim text.