Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same
AssigneesCommissariat a l'Energie Atomique, Alchimer
InventorsChristophe Bureau, Julienne Charlier
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Abstract
The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: a) the electrografting of an organic film onto the conductive or semiconductive surface; and then b) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted. It also relates to applications of this method and to structures obtained by its implementation.
Claims20
A method of bonding a first object having a polymer surface together with a second object having an electrically conductive or semiconductive surface, the method comprising the steps of:
- a) electrografting a polymer film onto the conductive or semiconductive surface of the second object;
- and then
- b) bonding the polymer surface of the first object to the polymer film electrografted onto the conductive or semiconductive surface of the second object;
- wherein the electrografting of the polymer film is an electroinitiated grafting, and
- wherein which the polymer film is obtained from compounds selected from the group consisting of monomers and prepolymers that are partly or completely functionalized by cyclic groups that can be cleaved by nucleophilic or electrophilic attack.
A method for bonding a first object having a polymer surface together with a second object having an electrically conductive or semiconductive surface, the method comprising the steps of:
- a) electrografting an organic film onto the conductive or semiconductive surface of the second object;
- and then
- b) bonding the polymer surface of the first object to the polymer film electrografted onto the conductive or semiconductive surface of the second object thus grafted,
- wherein the bonding includes a cold bonding or a combination of the cold bonding and a hotmelt bonding, and
- wherein the cold bonding is carried out by means of a substance capable of dissolving or swelling the polymer surface to be bonded and the organic film electrografted onto the conductive or semiconductive surface.
Dependencies are inferred from the claim text.