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US 7,605,014 B2Granted
Method of fabricating resistive probe having self-aligned metal shield
AssigneeSamsung Electronics Co., Ltd.
InventorsHong-sik Park, Ju-hwan Jung, Hyoung-soo Ko, Seung-bum Hong
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Abstract
A method of fabricating a resistive probe having a self-aligned metal shield. The method includes sequentially forming a first insulating layer, a metal shield, and a second insulating layer on a resistive tip of a substrate; etching the second insulating layer to expose the metal shield on a resistive region; etching the exposed metal shield; and etching the first insulating layer to expose the resistive region.
Claims10
A method of fabricating a resistive probe having a self-aligned metal shield, the method comprising:
- forming a resistive tip on a substrate that is doped with a first impurity, the resistive tip comprising a resistive region formed at a peak thereof and lightly doped with a second impurity, which is opposite in polarity to the first impurity, and first and second electrode regions formed on inclined surfaces thereof and heavily doped with the second impurity;
- sequentially forming a first insulating layer and a metal shield on the resistive tip;
- uniformly forming a second insulating layer to cover the metal shield;
- etching the second insulating layer to expose the metal shield on the resistive region;
- etching the exposed metal shield;
- and
- etching the first insulating layer to expose the resistive region.
4 more elements
Dependencies are inferred from the claim text.