Method of fabrication MEMS integrated circuits

A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof, said method comprising the steps of:

• (a) applying a polymer coating over said MEMS layer;
• (b) defining a plurality of frontside dicing streets through said polymer coating;
• (c) releasably attaching a first holding means to said polymer coating;
• and
• (d) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a protective polymer coating, said polymer coating being comprised of a polymerized siloxane.

A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof, said method comprising the steps of:

• (a) applying a polymer coating over said MEMS layer;
• (b) defining a plurality of frontside dicing streets through said polymer coating;
• (c) releasably attaching a first holding means to said polymer coating;
• and
• (d) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a protective polymer coating, said polymer coating being comprised of perfluorinated polyethylene (PFPE).