Polymer, top coating layer, top coating composition and immersion lithography process using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Jun Choi, Han-Ku Cho
Life of this patent
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Abstract
A polymer, a top coating layer, a top coating composition and an immersion lithography process using the same are provided. The polymer used as a top coating layer covering (or formed on) a photoresist may include a specific chemical structure. The top coating composition may include a solvent and a polymer of having the specific chemical structure. The immersion lithography process includes forming a photoresist layer on a wafer, forming a top coating layer on the photoresist layer, immersing the wafer in water, performing an exposure process on the photoresist layer and forming a photoresist pattern by removing the top coating layer and the photoresist layer with a developer.
Claims15
A top coating layer, comprising:
- a polymer having a chemical structure (1)
- wherein R1 represents a hydrogen or a methyl group;
- R2 represents a cyclopentyl group;
- Y represents a propyl group;
- Z represents 2-hydroxyethyl methacrylate;
- the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 are satisfied;
- and a mass average molecular weight of the polymer is 5,000 to 100,000.
A top coating composition, comprising:
- polymer having a chemical structure (1)
- wherein R1 represents a hydrogen or a methyl group;
- R2 represents at least one from the group consisting of a hydrogen, an alkyl group, an alkenyl group, an alkoxy group and an aryl group;
- Y represents a space group having 2 to 6 carbons;
- Z represents an ethylene monomer having at least one of a hydroxy group and a carboxyl group;
- the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 are satisfied;
- and a mass average molecular weight of the polymer is 5,000 to 100,000;
- and
- a solvent selected at least one from the group consisting of a 4-methyl-2-pentanol, isobutanol, isooctanol and decane,
- wherein the polymer has a percentage of solution by mass (mass %) of 1% to 10% of a total weight of the composition.
A top coating composition, comprising:
- polymer having a chemical structure (1)
- wherein R1 represents a hydrogen or a methyl group;
- R2 represents at least one from the group consisting of a hydrogen, an alkyl group, an alkenyl group, an alkoxy group and an aryl group;
- Y represents a space group having 2 to 6 carbons;
- Z represents an ethylene monomer having at least one of a hydroxy group and a carboxyl group;
- the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 are satisfied;
- and a mass average molecular weight of the polymer is 5,000 to 100,000;
- and
- a solvent having 4 to 12 carbons, wherein the solvent is a mixed solution including 95% of decane and 5% of an alcohol-series solvent,
- wherein the polymer has a percentage of solution by mass (mass %) of 1% to 10% of a total weight of the composition.
A top coating composition, comprising:
- a solvent having 4 to 12 carbons;
- and
- a polymer having chemical structure (1)
- R1 representing a hydrogen or a methyl group, R2 representing a cyclopentyl group, Y representing a propyl group, Z represents 2-hydroxyethyl methacrylic acid, the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 being satisfied,
- a mass average molecular weight of the polymer being 5,000 to 100,000, and
- the polymer having a percentage of solution by mass (mass %) of 3% to 5% of the total weight of the composition.
An immersion lithography process, comprising:
- forming a photoresist layer on a wafer;
- forming a top coating layer on the photoresist layer, wherein the top coating layer includes a polymer having a chemical structure (1)
- wherein R1 represents a hydrogen or a methyl group;
- R2 represents at least one selected from the group consisting of a hydrogen, an alkyl group, an alkenyl group, an alkoxy group, and an aryl group;
- Y represents a space group having 2 to 6 carbons;
- Z represents an ethylene monomer having at least one of a hydroxy group and a carboxyl group;
- the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 are satisfied;
- and a mass average molecular weight of the polymer is 5,000 to 100,000;
- immersing the wafer in water;
- performing an exposure process on the photoresist layer;
- and
- forming a photoresist pattern by removing the top coating layer and an unexposed portion of the photoresist layer or the exposed photoresist layer with a developer.
A polymer, comprising:
- a chemical structure (1)
- wherein R1 represents a hydrogen or a methyl group;
- R2 represents a cyclopentyl group;
- Y represents a propyl group;
- Z represents methacrylic acid;
- the expressions m/(m+n)=0.1 to 0.7 and n/(m+n)=0.3 to 0.9 are satisfied;
- and
- a comonomer formed of 2-hydroxyethyl methacrylate, a mass average molecular weight of the polymer being 5,000 to 100,000.
Dependencies are inferred from the claim text.